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BCM56854XA2IFSBG

BCM56854XA2IFSBG

Manufacturer No:

BCM56854XA2IFSBG

Manufacturer:

Broadcom Limited

Description:

IC TELECOM INTERFACE MULTI LAYER

Datasheet:

Datasheet

Delivery:

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BCM56854XA2IFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Interface
    -
  • Function
    Switch
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The BCM56854XA2IFSBG integrated circuit chips, also known as the Broadcom Tomahawk 3, are high-performance Ethernet switch chips designed for data center and cloud networking applications. Some of the advantages and application scenarios of these chips include:1. High Performance: The BCM56854XA2IFSBG chips offer high port density and throughput, enabling data centers to handle large amounts of network traffic efficiently. They support up to 64 ports of 100 Gigabit Ethernet (GbE) or 256 ports of 25 GbE, providing ample bandwidth for demanding applications.2. Low Latency: These chips are designed to minimize latency, ensuring fast and responsive network communication. This is crucial for real-time applications, such as financial trading, high-frequency trading, and telecommunications.3. Advanced Features: The chips support various advanced features like Quality of Service (QoS), Virtual Local Area Networks (VLANs), Access Control Lists (ACLs), and Network Address Translation (NAT). These features enable network administrators to prioritize traffic, segment networks, and enhance security.4. Scalability: The BCM56854XA2IFSBG chips are highly scalable, allowing data centers to expand their network infrastructure as needed. They can be used in large-scale deployments, accommodating the growing demands of cloud computing and virtualization.5. Energy Efficiency: Broadcom has incorporated power-saving technologies into these chips, making them energy-efficient. This is important for data centers aiming to reduce their carbon footprint and operating costs.6. Data Center Networks: The BCM56854XA2IFSBG chips are primarily used in data center networks, where high-performance and low-latency switching are critical. They are suitable for hyperscale data centers, cloud service providers, and enterprise data centers.7. Cloud Networking: With the increasing adoption of cloud computing, these chips find applications in cloud networking infrastructure. They enable efficient and reliable connectivity between cloud servers, storage systems, and network devices.8. High-Speed Interconnects: The chips can be used in high-speed interconnects for supercomputers, high-performance computing clusters, and large-scale storage systems. They provide the necessary bandwidth and low latency for these demanding applications.Overall, the BCM56854XA2IFSBG integrated circuit chips offer high performance, low latency, advanced features, scalability, and energy efficiency, making them suitable for data center and cloud networking applications that require fast and reliable network connectivity.
BCM56854XA2IFSBG Relevant information