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BCM88661A0KFSBLG

BCM88661A0KFSBLG

Manufacturer No:

BCM88661A0KFSBLG

Manufacturer:

Broadcom Limited

Description:

TRAFFIC MGR PACKETPROC

Datasheet:

Datasheet

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BCM88661A0KFSBLG Specifications

  • Type
    Parameter
  • Supplier Device Package
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  • Package / Case
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  • Mounting Type
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  • Operating Temperature
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  • Current - Supply
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  • Voltage - Supply
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  • Interface
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  • Packaging
    Tray
  • Product Status
    Active
  • Series
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The BCM88661A0KFSBLG is a specific model of integrated circuit (IC) chip developed by Broadcom. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for the BCM88661A0KFSBLG:Advantages: 1. High Performance: The BCM88661A0KFSBLG is designed to deliver high-performance networking capabilities, making it suitable for demanding applications. 2. Scalability: The chip offers scalability, allowing it to be used in various network infrastructure setups, from small-scale deployments to large-scale data centers. 3. Power Efficiency: Broadcom focuses on power efficiency in its designs, which can help reduce energy consumption and operational costs. 4. Integration: The chip integrates multiple functions and features into a single package, reducing the need for additional components and simplifying system design. 5. Flexibility: The BCM88661A0KFSBLG supports various networking protocols and interfaces, providing flexibility in network deployments.Application Scenarios: 1. Data Centers: The high-performance and scalability of the BCM88661A0KFSBLG make it suitable for data center applications, where it can handle large volumes of network traffic and support high-speed connectivity. 2. Service Provider Networks: The chip can be used in service provider networks to deliver high-speed and reliable connectivity for various services, such as internet access, voice, and video. 3. Enterprise Networks: The BCM88661A0KFSBLG can be utilized in enterprise networks to provide high-performance networking capabilities, supporting critical business applications and ensuring efficient communication. 4. Telecommunication Infrastructure: The chip can be integrated into telecommunication infrastructure equipment, such as routers and switches, to enable high-speed data transmission and reliable network connectivity. 5. Cloud Computing: The scalability and power efficiency of the BCM88661A0KFSBLG make it suitable for cloud computing environments, where it can handle the networking requirements of virtualized and distributed systems.It's important to note that the specific advantages and application scenarios may vary based on the requirements and use cases of the end-user.
BCM88661A0KFSBLG Relevant information