BCM56640XB0KFSBG

BCM56640XB0KFSBG

Manufacturer No:

BCM56640XB0KFSBG

Manufacturer:

Broadcom Limited

Description:

IC TELECOM INTERFACE MULTI LAYER

Datasheet:

Datasheet

Delivery:

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BCM56640XB0KFSBG Specifications

  • Type
    Parameter
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The BCM56640XB0KFSBG is a high-performance integrated circuit chip developed by Broadcom. It is specifically designed for Ethernet switching applications and offers several advantages and application scenarios:Advantages: 1. High Performance: The chip provides high-speed Ethernet switching capabilities, supporting up to 64 ports of 10 Gigabit Ethernet (GbE) or 16 ports of 40 GbE. It offers low latency and high throughput, making it suitable for demanding networking environments.2. Scalability: The chip supports advanced features like Virtual Router Redundancy Protocol (VRRP), Link Aggregation Control Protocol (LACP), and Virtual Local Area Network (VLAN) tagging. It allows for flexible network configurations and can be easily scaled to accommodate growing network requirements.3. Power Efficiency: The BCM56640XB0KFSBG chip incorporates power-saving technologies, such as Energy Efficient Ethernet (EEE) and low-power idle modes. It helps reduce power consumption and contributes to energy-efficient network operations.4. Advanced Security: The chip includes features like Access Control Lists (ACLs), Secure Shell (SSH), and Secure Sockets Layer (SSL) encryption. It ensures secure data transmission and protects against unauthorized access or network attacks.Application Scenarios: 1. Data Centers: The high port density and performance of the chip make it suitable for data center environments. It can be used in top-of-rack switches, providing high-speed connectivity for servers and storage devices.2. Enterprise Networks: The chip can be utilized in enterprise networks to build high-performance switches. It enables efficient traffic management, VLAN segmentation, and secure communication, ensuring reliable and secure connectivity for various applications.3. Service Provider Networks: The chip's scalability and advanced features make it suitable for service provider networks. It can be used in carrier-grade switches or routers to deliver high-speed connectivity and advanced services to customers.4. Campus Networks: The chip can be employed in campus networks to build high-density switches. It enables efficient traffic handling, VLAN management, and security features, ensuring reliable and secure connectivity for educational institutions or large corporate campuses.Overall, the BCM56640XB0KFSBG integrated circuit chip offers high performance, scalability, power efficiency, and advanced security features, making it suitable for various Ethernet switching applications in data centers, enterprise networks, service provider networks, and campus networks.