BCM56640B0KFSBG

BCM56640B0KFSBG

Manufacturer No:

BCM56640B0KFSBG

Manufacturer:

Broadcom Limited

Description:

IC TELECOM INTERFACE MULTI LAYER

Datasheet:

Datasheet

Delivery:

Payment:

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BCM56640B0KFSBG Specifications

  • Type
    Parameter
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The BCM56640B0KFSBG integrated circuit chips, also known as the Broadcom StrataXGS Trident II Plus, have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The BCM56640B0KFSBG chips offer high-performance switching capabilities, enabling fast and efficient data transfer rates. 2. Scalability: These chips are designed to support large-scale networks, making them suitable for enterprise-level applications. 3. Flexibility: The chips support a wide range of network protocols and features, allowing for flexible network configurations. 4. Power Efficiency: The BCM56640B0KFSBG chips are designed to be power-efficient, reducing energy consumption and operating costs. 5. Advanced Features: These chips offer advanced features like virtualization, quality of service (QoS), and security, enhancing network performance and reliability.Application Scenarios: 1. Data Centers: The BCM56640B0KFSBG chips are commonly used in data center networks to provide high-speed and reliable connectivity between servers, storage systems, and network switches. 2. Enterprise Networks: These chips are suitable for large enterprise networks that require high-performance switching capabilities to handle heavy network traffic. 3. Service Provider Networks: The BCM56640B0KFSBG chips can be used in service provider networks to deliver high-speed internet connectivity and support various services like video streaming, VoIP, and cloud applications. 4. Campus Networks: These chips are ideal for campus networks that require high bandwidth and scalability to connect multiple buildings and support a large number of users. 5. Telecommunication Networks: The BCM56640B0KFSBG chips can be used in telecommunication networks to provide high-speed connectivity between different network elements, such as routers, switches, and base stations.Overall, the BCM56640B0KFSBG integrated circuit chips offer high-performance, scalability, and advanced features, making them suitable for various network applications in data centers, enterprises, service providers, campuses, and telecommunication networks.