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BCM56456B0IFSBG

BCM56456B0IFSBG

Manufacturer No:

BCM56456B0IFSBG

Manufacturer:

Broadcom Limited

Description:

100GBPS CARRIER ETHERNET SWITC

Datasheet:

Datasheet

Delivery:

Payment:

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BCM56456B0IFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Interface
    -
  • Function
    -
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    *
The BCM56456B0IFSBG integrated circuit chips, also known as the Broadcom StrataXGS Trident 3 Series, have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The Trident 3 Series chips offer high-performance switching capabilities, enabling fast and efficient data transfer rates. 2. Scalability: These chips are designed to support large-scale networks, making them suitable for enterprise-level applications. 3. Flexibility: The Trident 3 Series chips support various network protocols and features, allowing for flexible network configurations. 4. Power Efficiency: Broadcom has optimized the power consumption of these chips, making them energy-efficient and suitable for green networking solutions. 5. Advanced Features: The chips come with advanced features like deep packet inspection, quality of service (QoS) management, and security functionalities, enhancing network performance and security.Application Scenarios: 1. Data Centers: The Trident 3 Series chips are commonly used in data center networking equipment, such as switches and routers, due to their high performance and scalability. 2. Enterprise Networks: These chips are suitable for large enterprise networks that require high-speed and reliable data transfer, supporting various applications and services. 3. Service Provider Networks: Telecom service providers can utilize the Trident 3 Series chips in their network infrastructure to deliver high-speed internet connectivity and advanced services to their customers. 4. Campus Networks: Educational institutions or corporate campuses can benefit from these chips to build robust and scalable networks that can handle a large number of users and devices. 5. Cloud Computing: The Trident 3 Series chips can be used in cloud computing environments to ensure efficient data transfer and network management between servers and storage systems.Overall, the BCM56456B0IFSBG integrated circuit chips offer high performance, scalability, and advanced features, making them suitable for various networking applications in data centers, enterprise networks, service provider networks, campus networks, and cloud computing environments.
BCM56456B0IFSBG Relevant information