LE58083ABGCT

LE58083ABGCT

Manufacturer No:

LE58083ABGCT

Manufacturer:

Microsemi Corporation

Description:

IC TELECOM INTERFACE 121BGA

Datasheet:

Datasheet

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LE58083ABGCT Specifications

  • Type
    Parameter
  • Supplier Device Package
    121-LFBGA (10x10)
  • Package / Case
    121-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    3.3V
  • Number of Circuits
    1
  • Interface
    PCI
  • Function
    Subscriber Line Interface Concept (SLIC)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The LE58083ABGCT is a specific integrated circuit (IC) chip, and without more information about its specific features and capabilities, it is difficult to provide a comprehensive list of advantages and application scenarios. However, here are some general advantages and potential application scenarios for IC chips:Advantages of IC chips: 1. Miniaturization: IC chips allow for the integration of multiple electronic components onto a single chip, leading to smaller and more compact devices. 2. Power efficiency: IC chips are designed to be power-efficient, helping to conserve energy and extend battery life in portable devices. 3. Reliability: IC chips are manufactured using advanced processes, ensuring high reliability and long-term performance. 4. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them more affordable for various applications. 5. Versatility: IC chips can be designed for a wide range of applications, offering flexibility and adaptability.Application scenarios for IC chips: 1. Consumer electronics: IC chips are extensively used in smartphones, tablets, laptops, televisions, and other consumer electronic devices. 2. Automotive industry: IC chips are crucial for various automotive applications, including engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). 3. Industrial automation: IC chips play a vital role in industrial automation, controlling machinery, monitoring sensors, and enabling communication between devices. 4. Internet of Things (IoT): IC chips are used in IoT devices to enable connectivity, data processing, and communication with other devices. 5. Medical devices: IC chips are employed in medical devices such as pacemakers, insulin pumps, and diagnostic equipment, enabling precise control and data processing. 6. Aerospace and defense: IC chips are utilized in aerospace and defense applications, including avionics systems, radar systems, and communication equipment.It is important to note that the specific advantages and application scenarios of the LE58083ABGCT IC chip may vary depending on its unique features and specifications.