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BGT60E6327XTSA1

BGT60E6327XTSA1

Manufacturer No:

BGT60E6327XTSA1

Manufacturer:

Infineon Technologies

Description:

IC TELECOM INTERFACE SMD

Datasheet:

Datasheet

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BGT60E6327XTSA1 Specifications

  • Type
    Parameter
  • Supplier Device Package
    PG-WFWLB-119-1
  • Package / Case
    119-WFBGA, WLBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -
  • Current - Supply
    1 ~ 4mA
  • Voltage - Supply
    -
  • Number of Circuits
    1
  • Interface
    -
  • Function
    Transceiver
  • Packaging
    Bulk
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The BGT60E6327XTSA1 is an integrated circuit chip developed by Infineon Technologies. It is a high-frequency, high-power RF transistor designed for use in various applications. Some of the advantages and application scenarios of the BGT60E6327XTSA1 are:1. High Power and Frequency Capability: The BGT60E6327XTSA1 chip offers high power and frequency capabilities, making it suitable for applications that require high-performance RF amplification.2. Broadband Operation: This chip operates over a wide frequency range, enabling it to be used in various broadband applications.3. Wireless Communication Systems: The BGT60E6327XTSA1 chip is commonly used in wireless communication systems, such as cellular base stations, wireless local area networks (WLAN), and satellite communication systems.4. Radar Systems: Due to its high power and frequency capabilities, the BGT60E6327XTSA1 chip finds applications in radar systems, including automotive radar, weather radar, and military radar.5. Industrial Applications: The chip can be used in industrial applications that require high-frequency power amplification, such as industrial heating systems, plasma generators, and industrial process control.6. Test and Measurement Equipment: The BGT60E6327XTSA1 chip is also utilized in test and measurement equipment, including spectrum analyzers, signal generators, and network analyzers.7. Medical Equipment: It can be employed in medical equipment that requires high-frequency amplification, such as magnetic resonance imaging (MRI) systems and medical ultrasound devices.8. Aerospace and Defense: The BGT60E6327XTSA1 chip is suitable for aerospace and defense applications, including communication systems, electronic warfare, and radar systems.Overall, the BGT60E6327XTSA1 integrated circuit chip offers high power, frequency capabilities, and broadband operation, making it versatile for various applications in wireless communication, radar systems, industrial equipment, test and measurement, medical devices, and aerospace/defense sectors.
BGT60E6327XTSA1 Relevant information