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SI32266-C-FM1

SI32266-C-FM1

Manufacturer No:

SI32266-C-FM1

Manufacturer:

Skyworks Solutions Inc.

Description:

IC TELECOM INTERFACE 50QFN

Datasheet:

Datasheet

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Payment:

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SI32266-C-FM1 Specifications

  • Type
    Parameter
  • Supplier Device Package
    50-QFN (6x8)
  • Package / Case
    -
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    3.3V
  • Number of Circuits
    1
  • Interface
    GCI, PCM, SPI
  • Function
    Subscriber Line Interface Concept (SLIC), CODEC
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    ProSLIC®
The SI32266-C-FM1 is a specific model of integrated circuit (IC) chip manufactured by Silicon Labs. It is a highly integrated, low-power, and high-performance IC designed for use in various applications related to communication and networking. Some of the advantages and application scenarios of the SI32266-C-FM1 IC chip are:1. High Integration: The SI32266-C-FM1 chip integrates multiple functions into a single device, reducing the need for external components and simplifying the overall system design. It combines features like a microcontroller, digital signal processor (DSP), and various communication interfaces.2. Low Power Consumption: The chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Communication Interfaces: The SI32266-C-FM1 chip supports various communication interfaces such as UART, SPI, I2C, and GPIOs, enabling seamless integration with other devices or systems.4. Networking Applications: The chip is commonly used in networking applications such as Ethernet switches, routers, gateways, and industrial automation systems. It provides the necessary functionality for data processing, protocol handling, and network management.5. Industrial Automation: The SI32266-C-FM1 chip is well-suited for industrial automation applications, including factory automation, process control, and monitoring systems. Its integrated features and low power consumption make it ideal for such demanding environments.6. Internet of Things (IoT): With its high integration and low power consumption, the chip is suitable for IoT applications. It can be used in smart home devices, sensor networks, and other IoT-enabled systems.7. Audio/Video Processing: The SI32266-C-FM1 chip includes a DSP, making it suitable for audio and video processing applications. It can be used in devices like audio/video receivers, media players, and streaming devices.8. Consumer Electronics: The chip finds applications in various consumer electronics products, including set-top boxes, gaming consoles, home automation systems, and wearable devices.Overall, the SI32266-C-FM1 integrated circuit chip offers advantages such as high integration, low power consumption, and versatility, making it suitable for a wide range of communication, networking, industrial automation, IoT, and consumer electronics applications.
SI32266-C-FM1 Relevant information