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ZL38070GBG

ZL38070GBG

Manufacturer No:

ZL38070GBG

Manufacturer:

Microchip Technology

Description:

IC TELECOM INTERFACE 535BGA

Datasheet:

Datasheet

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ZL38070GBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    535-PBGA (31x31)
  • Package / Case
    535-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    10mA
  • Voltage - Supply
    1.6V ~ 2V
  • Number of Circuits
    1
  • Interface
    -
  • Function
    Echo Cancellation
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The ZL38070GBG integrated circuit (IC) chip is a highly versatile and advanced audio processing solution. Some of its advantages and application scenarios include:1. Advanced Audio Processing: The ZL38070GBG chip offers advanced audio processing capabilities, including acoustic echo cancellation, noise reduction, and beamforming. These features enhance audio quality and intelligibility in various applications.2. Voice-Enabled Devices: The chip is suitable for voice-enabled devices such as smart speakers, voice assistants, and conferencing systems. It enables clear and natural voice communication, even in noisy environments.3. Far-Field Voice Pickup: The ZL38070GBG chip supports far-field voice pickup, allowing devices to capture and process audio from a distance. This is particularly useful in applications where users are not in close proximity to the device, such as in large conference rooms or smart home setups.4. Multi-Microphone Array: The chip supports multi-microphone arrays, enabling spatial audio processing and beamforming. This helps in focusing on the desired sound source and suppressing background noise, resulting in improved voice recognition and audio quality.5. Hands-Free Communication: The ZL38070GBG chip is ideal for hands-free communication devices like car kits and hands-free headsets. It enhances voice clarity and cancels out echoes and noise, providing a seamless and immersive communication experience.6. Teleconferencing Systems: The chip can be used in teleconferencing systems to improve audio quality during conference calls. It ensures clear and intelligible communication, even in large meeting rooms with multiple participants.7. Smart Home Automation: The ZL38070GBG chip can be integrated into smart home automation systems, enabling voice control and interaction with various devices. It enhances the accuracy of voice commands and improves the overall user experience.8. Industrial Applications: The chip finds applications in industrial settings where voice communication is crucial, such as intercom systems, public address systems, and voice-controlled machinery. It ensures reliable and high-quality audio transmission in challenging environments.Overall, the ZL38070GBG integrated circuit chip offers advanced audio processing capabilities and finds applications in a wide range of voice-enabled devices and communication systems, enhancing audio quality, voice recognition, and user experience.
ZL38070GBG Relevant information