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ZL38065GDG2

ZL38065GDG2

Manufacturer No:

ZL38065GDG2

Manufacturer:

Microsemi Corporation

Description:

IC TELECOM INTERFACE 208LBGA

Datasheet:

Datasheet

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ZL38065GDG2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    208-LBGA (17x17)
  • Package / Case
    208-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    10mA
  • Voltage - Supply
    1.6V ~ 2V
  • Number of Circuits
    1
  • Interface
    -
  • Function
    Echo Cancellation
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The ZL38065GDG2 integrated circuit (IC) chip is a highly versatile and advanced audio processing solution. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the ZL38065GDG2 IC chip are:1. Advanced Audio Processing: The ZL38065GDG2 chip provides advanced audio processing capabilities, including acoustic echo cancellation, noise reduction, and beamforming. These features enhance the audio quality and intelligibility in applications such as conference systems, smart speakers, and voice-enabled devices.2. Multi-Microphone Array Support: The chip supports multi-microphone arrays, allowing for precise sound capture and localization. This feature is beneficial in applications like voice-controlled devices, where accurate voice recognition and command execution are crucial.3. Low Power Consumption: The ZL38065GDG2 chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where energy efficiency is essential.4. Flexible Configuration: The chip offers flexible configuration options, allowing developers to customize the audio processing algorithms and adapt them to specific application requirements. This flexibility makes it suitable for a wide range of audio processing applications.5. Wide Compatibility: The ZL38065GDG2 chip is compatible with various audio interfaces, including I2S, TDM, and PDM. This compatibility enables seamless integration with different audio systems and devices.6. Voice User Interface (VUI) Applications: The chip is well-suited for voice user interface applications, such as smart speakers, voice assistants, and voice-controlled home automation systems. Its advanced audio processing capabilities enhance the accuracy and responsiveness of voice commands.7. Conference Systems: The ZL38065GDG2 chip can be used in conference systems to improve audio quality during teleconferencing or video conferencing. It enables clear and echo-free communication, enhancing the overall conference experience.8. Automotive Applications: The chip can be applied in automotive systems, such as in-car infotainment systems or hands-free calling. Its noise reduction and echo cancellation features ensure clear audio communication even in noisy environments.Overall, the ZL38065GDG2 integrated circuit chip offers advanced audio processing capabilities, low power consumption, and flexibility, making it suitable for a wide range of applications, including smart speakers, voice-controlled devices, conference systems, automotive systems, and more.
ZL38065GDG2 Relevant information