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LE57D122BTCT

LE57D122BTCT

Manufacturer No:

LE57D122BTCT

Manufacturer:

Microchip Technology

Description:

IC TELECOM INTERFACE 44TQFP

Datasheet:

Datasheet

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LE57D122BTCT Specifications

  • Type
    Parameter
  • Supplier Device Package
    44-TQFP-EP (10x10)
  • Package / Case
    44-TQFP Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    4.75V ~ 5.25V
  • Number of Circuits
    2
  • Interface
    2-Wire
  • Function
    Subscriber Line Interface Concept (SLIC)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The LE57D122BTCT is a specific model of integrated circuit (IC) chip manufactured by ON Semiconductor. While specific advantages and application scenarios may vary depending on the requirements and use cases, here are some general advantages and potential application scenarios for the LE57D122BTCT:Advantages: 1. Low Power Consumption: The LE57D122BTCT is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 2. Small Form Factor: The chip comes in a compact package, allowing for space-saving designs and integration into small devices or systems. 3. High-Speed Data Transfer: The LE57D122BTCT supports high-speed data transfer rates, making it suitable for applications that require fast and efficient communication. 4. Wide Operating Voltage Range: The chip can operate within a wide voltage range, providing flexibility in various power supply scenarios. 5. Robustness and Reliability: The LE57D122BTCT is designed to be durable and reliable, ensuring stable performance even in challenging environments.Application Scenarios: 1. Internet of Things (IoT) Devices: The low power consumption and small form factor of the LE57D122BTCT make it suitable for IoT devices that require wireless connectivity, such as smart home devices, wearables, or sensor nodes. 2. Wireless Communication Systems: The high-speed data transfer capability of the chip makes it suitable for wireless communication systems, including Wi-Fi or Bluetooth modules, where fast and reliable data transmission is essential. 3. Industrial Automation: The LE57D122BTCT can be used in industrial automation applications, such as process control systems or monitoring devices, where low power consumption, robustness, and reliability are crucial. 4. Consumer Electronics: The chip can be utilized in various consumer electronic devices, including smartphones, tablets, or gaming consoles, where power efficiency, compact size, and high-speed data transfer are important factors. 5. Medical Devices: The LE57D122BTCT can find applications in medical devices, such as remote patient monitoring systems or wearable health trackers, where low power consumption and reliable wireless communication are required.It's important to note that the specific advantages and application scenarios may vary depending on the system design, requirements, and integration considerations.
LE57D122BTCT Relevant information