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LE57D111BTCT

LE57D111BTCT

Manufacturer No:

LE57D111BTCT

Manufacturer:

Microchip Technology

Description:

IC TELECOM INTERFACE 44TQFP

Datasheet:

Datasheet

Delivery:

Payment:

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LE57D111BTCT Specifications

  • Type
    Parameter
  • Supplier Device Package
    44-TQFP-EP (10x10)
  • Package / Case
    44-TQFP Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    9mA
  • Voltage - Supply
    4.75V ~ 5.25V
  • Number of Circuits
    2
  • Interface
    -
  • Function
    Subscriber Line Interface Concept (SLIC)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The LE57D111BTCT is a specific model of integrated circuit (IC) chip manufactured by ON Semiconductor. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for the LE57D111BTCT:Advantages: 1. Low Power Consumption: The LE57D111BTCT is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 2. Small Form Factor: The IC chip is available in a compact package, allowing for space-saving designs and integration into small devices or systems. 3. High-Speed Data Transfer: The LE57D111BTCT supports high-speed data transfer rates, making it suitable for applications that require fast and efficient communication. 4. Wide Operating Voltage Range: The chip can operate within a wide voltage range, providing flexibility in various power supply configurations. 5. Robustness and Reliability: The LE57D111BTCT is designed to be durable and reliable, ensuring stable performance even in challenging environments.Application Scenarios: 1. Internet of Things (IoT) Devices: The low power consumption and small form factor of the LE57D111BTCT make it suitable for IoT devices that require wireless communication capabilities, such as smart home devices, wearables, or sensor nodes. 2. Industrial Automation: The high-speed data transfer and robustness of the chip make it suitable for industrial automation applications, including control systems, data acquisition, or communication interfaces. 3. Consumer Electronics: The LE57D111BTCT can be used in various consumer electronic devices that require wireless connectivity, such as smartphones, tablets, or gaming consoles. 4. Medical Devices: The low power consumption and reliability of the chip make it suitable for medical devices, including wearable health monitors, remote patient monitoring systems, or medical implants. 5. Automotive Applications: The LE57D111BTCT can be used in automotive applications that require wireless communication, such as vehicle-to-vehicle (V2V) or vehicle-to-infrastructure (V2I) communication systems.It's important to note that the specific advantages and application scenarios may vary depending on the system design, requirements, and integration considerations. It is recommended to refer to the datasheet and consult with the manufacturer or technical experts for detailed information and guidance specific to your application.
LE57D111BTCT Relevant information