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BU8763FV-E2

BU8763FV-E2

Manufacturer No:

BU8763FV-E2

Manufacturer:

Description:

IC TELECOM INTERFACE SSOP-B16

Datasheet:

Datasheet

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BU8763FV-E2 Specifications

  • Type
    Parameter
  • Power (Watts)
    450 mW
  • Supplier Device Package
    16-SSOP-B
  • Package / Case
    16-LSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -20°C ~ 70°C
  • Current - Supply
    -
  • Voltage - Supply
    2.7V ~ 3.6V
  • Number of Circuits
    1
  • Interface
    -
  • Function
    Melody LSI
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The BU8763FV-E2 is an integrated circuit chip developed by ROHM Semiconductor. It is a system power supply IC that provides multiple voltage outputs for various applications. Some of the advantages and application scenarios of this chip are:1. High integration: The BU8763FV-E2 integrates multiple voltage regulators, including a step-down DC-DC converter, a low-dropout regulator (LDO), and a voltage detector. This high integration reduces the number of external components required, saving board space and simplifying the design.2. Wide input voltage range: The chip can operate with input voltages ranging from 3.5V to 40V, making it suitable for a wide range of applications, including automotive, industrial, and consumer electronics.3. Multiple output voltages: The BU8763FV-E2 provides multiple regulated output voltages, including a 5V output from the DC-DC converter and various voltage options from the LDO. This flexibility allows it to power different components in a system, such as microcontrollers, sensors, and communication modules.4. High efficiency: The DC-DC converter in the chip employs a synchronous rectification method, which improves efficiency and reduces power dissipation. This feature is particularly beneficial in battery-powered applications, where energy efficiency is crucial.5. Protection features: The BU8763FV-E2 incorporates various protection features, such as overcurrent protection, thermal shutdown, and undervoltage lockout. These protections ensure the safe operation of the chip and the connected components, enhancing system reliability.Application scenarios for the BU8763FV-E2 include:1. Automotive electronics: The chip's wide input voltage range and robust protection features make it suitable for automotive applications, such as infotainment systems, advanced driver-assistance systems (ADAS), and powertrain control modules.2. Industrial equipment: The chip's high integration and efficiency make it suitable for powering various industrial equipment, including factory automation systems, motor control units, and power supplies.3. Consumer electronics: The BU8763FV-E2 can be used in consumer electronics devices, such as smart home appliances, portable devices, and audio/video equipment, where multiple voltage outputs are required.4. IoT devices: With its compact size and low power consumption, the chip can be used in IoT devices, such as sensors, wearables, and smart meters, where space and energy efficiency are critical.Overall, the BU8763FV-E2 integrated circuit chip offers advantages like high integration, wide input voltage range, multiple output voltages, high efficiency, and protection features, making it suitable for various applications in automotive, industrial, consumer electronics, and IoT domains.
BU8763FV-E2 Relevant information