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SI3050-E1-GMR

SI3050-E1-GMR

Manufacturer No:

SI3050-E1-GMR

Manufacturer:

Skyworks Solutions Inc.

Description:

IC TELECOM INTERFACE 24QFN

Datasheet:

Datasheet

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Payment:

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SI3050-E1-GMR Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-QFN (4x4)
  • Package / Case
    24-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    8.5mA
  • Voltage - Supply
    3V ~ 3.6V
  • Number of Circuits
    1
  • Interface
    GCI, PCM, SPI
  • Function
    Direct Access Arrangement (DAA)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The SI3050-E1-GMR integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: These chips are designed to operate with low power requirements, making them suitable for battery-powered devices and energy-efficient applications. 2. High sensitivity: The chips have high sensitivity, enabling them to detect and process weak signals accurately. 3. Wide operating frequency range: They can operate over a wide frequency range, making them versatile for various wireless communication applications. 4. Compact size: The chips are small in size, allowing for easy integration into compact devices and circuit boards. 5. Cost-effective: These chips offer a cost-effective solution for wireless communication systems, making them suitable for mass production and commercial applications.Application scenarios: 1. Internet of Things (IoT): The SI3050-E1-GMR chips can be used in IoT devices for wireless connectivity, enabling communication between devices and data transmission to the cloud. 2. Wireless sensor networks: These chips can be utilized in wireless sensor networks for applications such as environmental monitoring, industrial automation, and smart agriculture. 3. Home automation: The chips can be integrated into home automation systems to enable wireless control and communication between various devices and appliances. 4. Wearable devices: Due to their low power consumption and small size, these chips can be used in wearable devices like fitness trackers, smartwatches, and healthcare monitoring devices. 5. Smart meters: The chips can be employed in smart metering systems for wireless data transmission between utility meters and data collection points. 6. Wireless communication modules: These chips can be used as a core component in wireless communication modules for applications like remote control systems, wireless audio/video transmission, and wireless data transfer.Overall, the SI3050-E1-GMR integrated circuit chips offer advantages such as low power consumption, high sensitivity, and wide operating frequency range, making them suitable for various wireless communication applications in IoT, sensor networks, home automation, wearables, smart meters, and wireless communication modules.
SI3050-E1-GMR Relevant information