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DS3170N+T&R

DS3170N+T&R

Manufacturer No:

DS3170N+T&R

Description:

IC TELECOM INTERFACE 100CSBGA

Datasheet:

Datasheet

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DS3170N+T&R Specifications

  • Type
    Parameter
  • Supplier Device Package
    100-CSBGA (11x11)
  • Package / Case
    100-LBGA, CSBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    120mA
  • Voltage - Supply
    3.135V ~ 3.465V
  • Number of Circuits
    1
  • Interface
    DS3, E3
  • Function
    Single-Chip Transceiver
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The DS3170N+T&R integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The DS3170N+T&R chips offer high-speed data transmission and processing capabilities, making them suitable for applications that require fast and efficient data handling. 2. Low Power Consumption: These chips are designed to operate with low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial. 3. Robust Communication: The DS3170N+T&R chips support reliable and secure communication protocols, ensuring the integrity and confidentiality of data transmission. 4. Versatility: These chips can be used in various applications, thanks to their flexible design and compatibility with different communication interfaces. 5. Compact Size: The DS3170N+T&R chips are compact in size, making them suitable for space-constrained applications or devices.Application Scenarios: 1. Internet of Things (IoT): The DS3170N+T&R chips can be used in IoT devices for data communication and processing, enabling seamless connectivity and efficient data transfer. 2. Industrial Automation: These chips can be employed in industrial automation systems for real-time data exchange, control, and monitoring, enhancing the overall efficiency and productivity of the system. 3. Smart Grids: The DS3170N+T&R chips can be utilized in smart grid systems for secure and reliable communication between various components, such as smart meters, sensors, and control units. 4. Automotive Electronics: These chips can be integrated into automotive electronics for applications like vehicle-to-vehicle communication, advanced driver assistance systems, and infotainment systems. 5. Medical Devices: The DS3170N+T&R chips can be used in medical devices for data transmission and processing, enabling remote patient monitoring, telemedicine, and healthcare data management.Overall, the DS3170N+T&R integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in various industries.
DS3170N+T&R Relevant information