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SI3050-E1-GM

SI3050-E1-GM

Manufacturer No:

SI3050-E1-GM

Manufacturer:

Skyworks Solutions Inc.

Description:

IC TELECOM INTERFACE 24QFN

Datasheet:

Datasheet

Delivery:

Payment:

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SI3050-E1-GM Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-QFN (4x4)
  • Package / Case
    24-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    8.5mA
  • Voltage - Supply
    3V ~ 3.6V
  • Number of Circuits
    1
  • Interface
    GCI, PCM, SPI
  • Function
    Direct Access Arrangement (DAA)
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The SI3050-E1-GM integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low Power Consumption: The SI3050-E1-GM chips are designed to operate with low power consumption, making them suitable for battery-powered devices and energy-efficient applications. 2. Small Form Factor: These chips come in a compact form factor, enabling their integration into space-constrained devices and systems. 3. High Performance: The SI3050-E1-GM chips offer high-performance capabilities, including fast data processing and efficient communication protocols. 4. Robust Communication: These chips support reliable and secure communication protocols, ensuring data integrity and protection. 5. Cost-Effective: The SI3050-E1-GM chips provide a cost-effective solution for various applications, making them suitable for mass production and deployment.Application Scenarios: 1. Internet of Things (IoT): The SI3050-E1-GM chips can be used in IoT devices and systems, enabling connectivity and communication between various smart devices. 2. Wireless Sensor Networks: These chips are suitable for wireless sensor networks, where low power consumption and reliable communication are essential for collecting and transmitting data. 3. Home Automation: The SI3050-E1-GM chips can be utilized in home automation systems, enabling control and monitoring of various devices and appliances. 4. Industrial Automation: These chips find applications in industrial automation, where they can facilitate communication between different machines and control systems. 5. Smart Grids: The SI3050-E1-GM chips can be employed in smart grid systems, enabling efficient communication and management of electricity distribution networks. 6. Wearable Devices: These chips can be integrated into wearable devices, such as fitness trackers or smartwatches, providing connectivity and communication capabilities. 7. Healthcare Monitoring: The SI3050-E1-GM chips can be used in healthcare monitoring devices, enabling the collection and transmission of vital signs and health-related data.Overall, the SI3050-E1-GM integrated circuit chips offer low power consumption, small form factor, high performance, and robust communication capabilities, making them suitable for a wide range of applications in IoT, automation, and connectivity domains.
SI3050-E1-GM Relevant information