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XRT75R06IB-F

XRT75R06IB-F

Manufacturer No:

XRT75R06IB-F

Manufacturer:

MaxLinear, Inc.

Description:

IC TELECOM INTERFACE 217BGA

Datasheet:

Datasheet

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Payment:

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XRT75R06IB-F Specifications

  • Type
    Parameter
  • Supplier Device Package
    217-BGA (23x23)
  • Package / Case
    217-BBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    725mA
  • Voltage - Supply
    3.135V ~ 3.465V
  • Number of Circuits
    6
  • Interface
    LIU
  • Function
    Line Interface Unit (LIU)
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The XRT75R06IB-F integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-speed data transmission: The XRT75R06IB-F chips are designed for high-speed data transmission applications, offering data rates up to 6.25 Gbps. This makes them suitable for applications that require fast and reliable data transfer.2. Low power consumption: These chips are designed to operate with low power consumption, making them energy-efficient. This is particularly beneficial for applications that require long battery life or low power consumption.3. Small form factor: The XRT75R06IB-F chips are available in a small form factor, making them suitable for applications with space constraints. They can be easily integrated into compact devices or systems.4. Wide operating temperature range: These chips can operate in a wide temperature range, typically from -40°C to +85°C. This makes them suitable for applications that require operation in extreme temperature conditions.Application scenarios: 1. High-speed communication systems: The XRT75R06IB-F chips can be used in high-speed communication systems, such as optical transceivers, fiber optic networks, or high-speed data links. They enable fast and reliable data transmission over long distances.2. Data centers and servers: These chips can be used in data centers and servers to facilitate high-speed data transfer between different components or systems. They can be used in applications like storage area networks (SANs), network switches, or high-performance computing systems.3. Industrial automation: The XRT75R06IB-F chips can be used in industrial automation systems that require high-speed data communication, such as robotics, machine vision systems, or control systems. They enable real-time data transfer and communication between different components.4. Medical devices: These chips can be used in medical devices that require high-speed data transmission, such as medical imaging systems, patient monitoring devices, or telemedicine systems. They ensure fast and accurate data transfer for efficient diagnosis and treatment.5. Automotive applications: The XRT75R06IB-F chips can be used in automotive applications that require high-speed data communication, such as advanced driver-assistance systems (ADAS), infotainment systems, or vehicle-to-vehicle communication. They enable reliable and fast data transfer for enhanced safety and connectivity.Overall, the XRT75R06IB-F integrated circuit chips offer high-speed data transmission, low power consumption, small form factor, and wide operating temperature range, making them suitable for various applications that require fast and reliable data communication.
XRT75R06IB-F Relevant information