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XRT75R03DIV-F

XRT75R03DIV-F

Manufacturer No:

XRT75R03DIV-F

Manufacturer:

MaxLinear, Inc.

Description:

IC TELECOM INTERFACE 128LQFP

Datasheet:

Datasheet

Delivery:

Payment:

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XRT75R03DIV-F Specifications

  • Type
    Parameter
  • Supplier Device Package
    128-LQFP (14x20)
  • Package / Case
    128-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    410mA
  • Voltage - Supply
    3.135V ~ 3.465V
  • Number of Circuits
    3
  • Interface
    LIU
  • Function
    Line Interface Unit (LIU)
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The XRT75R03DIV-F integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-speed data transmission: The XRT75R03DIV-F chips are designed for high-speed data transmission applications, offering data rates up to 3.125 Gbps. This makes them suitable for applications that require fast and reliable data transfer.2. Low power consumption: These chips are designed to operate with low power consumption, making them energy-efficient. This is particularly beneficial for applications that require long battery life or operate in power-constrained environments.3. Small form factor: The XRT75R03DIV-F chips are available in a compact form factor, making them suitable for space-constrained applications. Their small size allows for easy integration into various electronic devices.4. Robust performance: These chips are designed to provide robust performance, ensuring reliable data transmission even in challenging environments. They offer features like equalization, clock and data recovery, and error detection and correction, which enhance the overall performance and reliability of the system.Application scenarios: 1. High-speed communication systems: The XRT75R03DIV-F chips are commonly used in high-speed communication systems, such as fiber-optic networks, where fast and reliable data transmission is crucial. They can be used in applications like data centers, telecommunications, and high-speed internet connections.2. Industrial automation: These chips find applications in industrial automation systems that require high-speed data transfer between various components. They can be used in applications like robotics, machine vision, and control systems, where real-time data transmission is essential.3. Medical devices: The XRT75R03DIV-F chips can be utilized in medical devices that require high-speed data transfer, such as medical imaging systems, patient monitoring devices, and telemedicine applications. Their low power consumption and small form factor make them suitable for portable medical devices.4. Automotive electronics: These chips can be employed in automotive electronics, particularly in applications that involve high-speed data communication, such as advanced driver-assistance systems (ADAS), infotainment systems, and vehicle-to-vehicle communication.Overall, the XRT75R03DIV-F integrated circuit chips offer high-speed data transmission, low power consumption, and robust performance, making them suitable for a wide range of applications that require fast and reliable data transfer.
XRT75R03DIV-F Relevant information