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XRT75R03DIV

XRT75R03DIV

Manufacturer No:

XRT75R03DIV

Manufacturer:

MaxLinear, Inc.

Description:

IC TELECOM INTERFACE 128LQFP

Datasheet:

Datasheet

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Payment:

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XRT75R03DIV Specifications

  • Type
    Parameter
  • Supplier Device Package
    128-LQFP (14x20)
  • Package / Case
    128-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    410mA
  • Voltage - Supply
    3.135V ~ 3.465V
  • Number of Circuits
    3
  • Interface
    LIU
  • Function
    Line Interface Unit (LIU)
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The XRT75R03DIV integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-speed data transmission: The XRT75R03DIV chips are designed for high-speed data transmission applications, offering fast and efficient data transfer rates. 2. Low power consumption: These chips are optimized for low power consumption, making them suitable for battery-powered devices or applications where power efficiency is crucial. 3. Compact size: The XRT75R03DIV chips are compact in size, allowing for easy integration into various electronic devices and systems. 4. Robust performance: These chips are designed to provide reliable and stable performance, ensuring the integrity of data transmission even in challenging environments. 5. Wide operating temperature range: The XRT75R03DIV chips can operate within a wide temperature range, making them suitable for applications in extreme temperature conditions.Application scenarios: 1. Telecommunications: The XRT75R03DIV chips can be used in telecommunications equipment, such as routers, switches, and optical transceivers, to enable high-speed data transmission between network devices. 2. Data centers: These chips can be utilized in data centers to facilitate fast and efficient data transfer between servers, storage systems, and networking equipment. 3. Industrial automation: The XRT75R03DIV chips can be integrated into industrial automation systems, enabling high-speed communication between various components and devices, such as PLCs (Programmable Logic Controllers) and sensors. 4. Automotive electronics: These chips can be employed in automotive electronics, such as advanced driver-assistance systems (ADAS) or infotainment systems, to enable fast and reliable data communication between different vehicle components. 5. Medical devices: The XRT75R03DIV chips can be used in medical devices, such as imaging systems or patient monitoring equipment, to ensure high-speed and accurate data transmission between different medical devices.Overall, the XRT75R03DIV integrated circuit chips offer advantages in terms of high-speed data transmission, low power consumption, compact size, robust performance, and wide operating temperature range, making them suitable for various applications in telecommunications, data centers, industrial automation, automotive electronics, and medical devices.
XRT75R03DIV Relevant information