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XRT75L06IB-F

XRT75L06IB-F

Manufacturer No:

XRT75L06IB-F

Manufacturer:

MaxLinear, Inc.

Description:

IC TELECOM INTERFACE 217BGA

Datasheet:

Datasheet

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XRT75L06IB-F Specifications

  • Type
    Parameter
  • Supplier Device Package
    217-BGA (23x23)
  • Package / Case
    217-BBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    3.135V ~ 3.465V
  • Number of Circuits
    6
  • Interface
    LIU
  • Function
    Line Interface Unit (LIU)
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The XRT75L06IB-F is an integrated circuit (IC) chip designed for high-speed, low-power, and low-voltage applications. Some of the advantages and application scenarios of this chip are as follows:1. Low power consumption: The XRT75L06IB-F chip is designed to operate at low power levels, making it suitable for battery-powered devices or applications where power efficiency is crucial.2. High-speed data transmission: This IC chip supports high-speed data transmission rates, making it ideal for applications that require fast and reliable communication, such as networking equipment, data centers, or telecommunications systems.3. Low-voltage operation: The XRT75L06IB-F chip operates at low voltage levels, which makes it suitable for applications that require low-power supply or have strict voltage requirements.4. Small form factor: This IC chip is designed to be compact and lightweight, making it suitable for applications where space is limited, such as portable devices or embedded systems.5. Wide temperature range: The XRT75L06IB-F chip is designed to operate reliably over a wide temperature range, making it suitable for applications that require operation in extreme temperature conditions.6. Communication interfaces: This IC chip supports various communication interfaces, such as SPI (Serial Peripheral Interface) and I2C (Inter-Integrated Circuit), enabling easy integration with other devices or systems.Application scenarios for the XRT75L06IB-F chip include:1. Networking equipment: This IC chip can be used in routers, switches, or network interface cards to enable high-speed data transmission and low-power operation.2. Data centers: The XRT75L06IB-F chip can be used in servers or storage systems to facilitate fast and efficient data communication while minimizing power consumption.3. Telecommunications systems: This IC chip can be used in telecom infrastructure equipment, such as base stations or optical network units, to enable high-speed data transmission and low-voltage operation.4. Portable devices: The XRT75L06IB-F chip can be used in smartphones, tablets, or wearable devices to enable fast and efficient communication while prolonging battery life.5. Industrial automation: This IC chip can be used in industrial control systems or sensors to enable reliable and efficient communication in harsh environments.Overall, the XRT75L06IB-F chip offers advantages such as low power consumption, high-speed data transmission, low-voltage operation, and small form factor, making it suitable for a wide range of applications requiring efficient and reliable communication.
XRT75L06IB-F Relevant information