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XRT75L03DIV-F

XRT75L03DIV-F

Manufacturer No:

XRT75L03DIV-F

Manufacturer:

MaxLinear, Inc.

Description:

IC TELECOM INTERFACE 128LQFP

Datasheet:

Datasheet

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XRT75L03DIV-F Specifications

  • Type
    Parameter
  • Supplier Device Package
    128-LQFP (14x20)
  • Package / Case
    128-LQFP Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    480mA
  • Voltage - Supply
    3.135V ~ 3.465V
  • Number of Circuits
    3
  • Interface
    LIU
  • Function
    Line Interface Unit (LIU)
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The XRT75L03DIV-F integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-speed data transmission: The XRT75L03DIV-F chips support data rates up to 3.125 Gbps, making them suitable for high-speed communication applications. 2. Low power consumption: These chips are designed to operate with low power consumption, making them energy-efficient and suitable for battery-powered devices. 3. Small form factor: The XRT75L03DIV-F chips are available in small package sizes, making them suitable for space-constrained applications. 4. Wide operating temperature range: These chips can operate in a wide temperature range, making them suitable for industrial applications that require robust performance in harsh environments. 5. Built-in signal conditioning: The chips have built-in signal conditioning features like equalization and pre-emphasis, which help to compensate for signal degradation and improve signal integrity.Application scenarios: 1. High-speed data communication: The XRT75L03DIV-F chips can be used in applications that require high-speed data transmission, such as optical networking, data centers, and high-speed serial links. 2. Industrial automation: These chips can be used in industrial automation systems that require reliable and high-speed communication between various devices and sensors. 3. Medical devices: The XRT75L03DIV-F chips can be used in medical devices that require high-speed data transmission, such as medical imaging systems and patient monitoring devices. 4. Automotive electronics: These chips can be used in automotive electronics applications that require high-speed communication between different modules and sensors, such as advanced driver-assistance systems (ADAS) and infotainment systems. 5. Aerospace and defense: The XRT75L03DIV-F chips can be used in aerospace and defense applications that require high-speed and reliable communication in harsh environments, such as avionics systems and military communication systems.
XRT75L03DIV-F Relevant information