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XRT73L06IB-F

XRT73L06IB-F

Manufacturer No:

XRT73L06IB-F

Manufacturer:

MaxLinear, Inc.

Description:

IC TELECOM INTERFACE 217BGA

Datasheet:

Datasheet

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XRT73L06IB-F Specifications

  • Type
    Parameter
  • Supplier Device Package
    217-BGA (23x23)
  • Package / Case
    217-BBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    3.135V ~ 3.465V
  • Number of Circuits
    6
  • Interface
    LIU
  • Function
    Line Interface Unit (LIU)
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The XRT73L06IB-F is an integrated circuit (IC) chip designed for high-speed data transmission and reception in communication systems. Some of the advantages and application scenarios of this chip are:1. High-speed data transmission: The XRT73L06IB-F chip supports data rates up to 6.25 Gbps, making it suitable for applications that require fast and reliable data transfer.2. Low power consumption: This chip is designed to operate with low power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial.3. Small form factor: The XRT73L06IB-F chip comes in a compact package, allowing for easy integration into various communication systems and devices.4. Wide operating temperature range: This chip can operate reliably in a wide temperature range, making it suitable for applications in harsh environments.5. Application scenarios: The XRT73L06IB-F chip finds applications in various communication systems, including high-speed data transmission over copper cables, optical communication systems, and networking equipment.6. Fiber optic communication: The chip can be used in fiber optic transceivers to enable high-speed data transmission over long distances.7. Data center networking: The XRT73L06IB-F chip can be used in networking equipment within data centers to facilitate high-speed data transfer between servers and switches.8. Telecommunication systems: This chip can be used in telecommunication systems to enable high-speed data transmission over copper cables, such as in DSL (Digital Subscriber Line) or Ethernet applications.9. Test and measurement equipment: The XRT73L06IB-F chip can be used in test and measurement equipment to analyze and monitor high-speed data signals.Overall, the XRT73L06IB-F chip offers high-speed data transmission, low power consumption, and small form factor, making it suitable for various communication applications that require reliable and efficient data transfer.
XRT73L06IB-F Relevant information