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DS3171N+

DS3171N+

Manufacturer No:

DS3171N+

Description:

IC TELECOM INTERFACE 400BGA

Datasheet:

Datasheet

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DS3171N+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    400-PBGA (27x27)
  • Package / Case
    400-BBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    273mA
  • Voltage - Supply
    3.135V ~ 3.465V
  • Number of Circuits
    1
  • Interface
    DS3, E3
  • Function
    Single-Chip Transceiver
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The DS3171N+ integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of DS3171N+ chips are:1. High Accuracy: The DS3171N+ chips provide high accuracy in measuring temperature, voltage, and current. This makes them suitable for applications that require precise measurements, such as industrial control systems, power management, and instrumentation.2. Low Power Consumption: These chips have low power consumption, making them ideal for battery-powered devices or applications where energy efficiency is crucial. They can be used in portable devices, wireless sensor networks, and IoT applications.3. Small Form Factor: The DS3171N+ chips are available in small form factors, making them suitable for space-constrained applications. They can be integrated into compact devices, wearable technology, and miniaturized electronics.4. Robustness and Reliability: These chips are designed to be robust and reliable, with features like overvoltage protection, thermal shutdown, and fault detection. They can withstand harsh operating conditions and are suitable for automotive, aerospace, and industrial applications.5. Communication Interfaces: The DS3171N+ chips support various communication interfaces such as I2C, SPI, and UART. This enables easy integration with microcontrollers and other digital systems, making them versatile for a wide range of applications.6. Temperature Sensing and Control: The DS3171N+ chips have built-in temperature sensing capabilities, allowing them to monitor and control temperature in real-time. They can be used in HVAC systems, thermal management, and temperature-controlled environments.7. Data Logging and Monitoring: These chips can store and log data, enabling applications such as data logging, event monitoring, and system diagnostics. They can be used in environmental monitoring, equipment maintenance, and data acquisition systems.Overall, the DS3171N+ integrated circuit chips offer high accuracy, low power consumption, small form factor, robustness, and various communication interfaces. These features make them suitable for a wide range of applications, including industrial control, power management, IoT, temperature sensing, data logging, and monitoring.
DS3171N+ Relevant information