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SI3200-G-FSR

SI3200-G-FSR

Manufacturer No:

SI3200-G-FSR

Manufacturer:

Skyworks Solutions Inc.

Description:

IC TELECOM INTERFACE 16SOIC

Datasheet:

Datasheet

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SI3200-G-FSR Specifications

  • Type
    Parameter
  • Power (Watts)
    941 mW
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width) Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    110µA
  • Voltage - Supply
    3.3V, 5V
  • Number of Circuits
    2
  • Interface
    GCI, PCM, SPI
  • Function
    Subscriber Line Interface Concept (SLIC), CODEC
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    ProSLIC®
The SI3200-G-FSR is an integrated circuit chip developed by Silicon Labs. It is a highly integrated, low-power, and high-performance audio codec designed for a wide range of applications. Some of the advantages and application scenarios of the SI3200-G-FSR chip are:1. High Integration: The SI3200-G-FSR integrates multiple audio functions into a single chip, including ADC (Analog-to-Digital Converter), DAC (Digital-to-Analog Converter), audio processing, and amplification. This high level of integration reduces the need for external components, simplifies the design, and saves board space.2. Low Power Consumption: The chip is designed to operate at low power, making it suitable for battery-powered devices or applications where power efficiency is crucial. It incorporates power-saving features such as power-down modes and adjustable power levels, enabling longer battery life.3. High Performance: The SI3200-G-FSR offers high-quality audio performance with low distortion and noise levels. It supports various audio formats and sampling rates, providing flexibility for different applications. The chip also includes advanced audio processing algorithms, such as equalization, filtering, and dynamic range control, enhancing the audio experience.4. Wide Application Range: The SI3200-G-FSR chip finds applications in various industries and products, including consumer electronics, automotive, industrial automation, and telecommunications. It can be used in devices such as smartphones, tablets, portable media players, smart speakers, automotive infotainment systems, and voice-enabled IoT devices.5. Audio Connectivity: The chip supports multiple audio interfaces, including I2S (Inter-IC Sound), PCM (Pulse Code Modulation), and TDM (Time Division Multiplexing). This enables seamless integration with other audio components and systems, facilitating audio data transfer and processing.6. Flexibility and Customization: The SI3200-G-FSR chip provides programmable features and configurations, allowing customization based on specific application requirements. It offers software control and configuration options, enabling developers to optimize the audio performance and functionality for their particular use case.Overall, the SI3200-G-FSR integrated circuit chip offers a combination of high integration, low power consumption, and high-performance audio capabilities, making it suitable for a wide range of applications where audio processing and connectivity are essential.
SI3200-G-FSR Relevant information