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PEF 3314 E V2.2-G

PEF 3314 E V2.2-G

Manufacturer No:

PEF 3314 E V2.2-G

Manufacturer:

Infineon Technologies

Description:

IC TELECOM INTERFACE 176-LBGA

Datasheet:

Datasheet

Delivery:

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PEF 3314 E V2.2-G Specifications

  • Type
    Parameter
  • Number of Circuits
    4
  • Supplier Device Package
    PG-LBGA-176
  • Package / Case
    176-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Interface
    JTAG, PCM, SCI/SPI
  • Function
    Analog Voice Access
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    VINETIC®
The PEF 3314 E V2.2-G integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of these chips are:Advantages: 1. High Performance: The PEF 3314 E V2.2-G chips are designed to deliver high performance in terms of data processing and communication capabilities. 2. Energy Efficiency: These chips are optimized for energy efficiency, ensuring minimal power consumption during operation. 3. Compact Size: The integrated circuit chips are compact in size, making them suitable for applications with space constraints. 4. Versatility: The chips offer versatile functionality, enabling them to be used in a wide range of applications. 5. Reliability: The PEF 3314 E V2.2-G chips are known for their reliability and robustness, ensuring consistent performance over time.Application Scenarios: 1. Telecommunications: These chips can be used in telecommunications equipment, such as routers, switches, and network interface cards, to enable high-speed data processing and communication. 2. Internet of Things (IoT): The PEF 3314 E V2.2-G chips can be applied in IoT devices, allowing them to connect to networks and exchange data efficiently. 3. Industrial Automation: These chips can be utilized in industrial automation systems, enabling real-time data processing and communication for efficient control and monitoring. 4. Smart Grids: The chips can be integrated into smart grid infrastructure, facilitating reliable and secure communication between various components of the grid. 5. Automotive Electronics: These chips can be used in automotive electronics, such as advanced driver-assistance systems (ADAS) and infotainment systems, to enable high-speed data processing and communication.Overall, the PEF 3314 E V2.2-G integrated circuit chips offer high performance, energy efficiency, and versatility, making them suitable for various applications in telecommunications, IoT, industrial automation, smart grids, and automotive electronics.
PEF 3314 E V2.2-G Relevant information