PEF 20512 E V1.2-G
Manufacturer No:
PEF 20512 E V1.2-G
Manufacturer:
Description:
IC TELECOM INTERFACE 323FCLBGA
Datasheet:
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In Stock : 0
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PEF 20512 E V1.2-G Specifications
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TypeParameter
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Power (Watts)2 W
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Supplier Device Package323-FCLBGA
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Package / Case323-BBGA, FCBGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Current - Supply-
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Voltage - Supply-
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InterfaceE1, HDLC, PPP, Serial, T1, TMA
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FunctionMultichannel Network Interface Controller (MUNICH)
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PackagingTray
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Product StatusObsolete
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Series-
The PEF 20512 E V1.2-G integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The chips offer high-speed data processing capabilities, enabling efficient and fast communication. 2. Versatility: They support various communication protocols, making them suitable for a wide range of applications. 3. Low Power Consumption: The chips are designed to consume minimal power, making them energy-efficient. 4. Compact Size: The integrated circuit chips are small in size, allowing for easy integration into different devices and systems. 5. Reliability: They are built with robust components and undergo rigorous testing, ensuring high reliability and durability.Application Scenarios: 1. Telecommunication Systems: The chips can be used in telecommunication systems, such as routers, switches, and gateways, to enable efficient data transmission and communication. 2. Internet of Things (IoT): They can be integrated into IoT devices, such as smart home appliances, industrial sensors, and wearable devices, to enable seamless connectivity and data exchange. 3. Industrial Automation: The chips can be utilized in industrial automation systems, such as PLCs (Programmable Logic Controllers) and SCADA (Supervisory Control and Data Acquisition) systems, to enable reliable and efficient communication between different components. 4. Automotive Electronics: They can be used in automotive electronics, such as infotainment systems, telematics, and advanced driver-assistance systems (ADAS), to enable secure and high-speed communication. 5. Smart Grids: The chips can be employed in smart grid systems to enable efficient communication between power generation, distribution, and consumption components, facilitating better energy management and grid optimization.Overall, the PEF 20512 E V1.2-G integrated circuit chips offer high performance, versatility, and low power consumption, making them suitable for various communication-intensive applications in different industries.
PEF 20512 E V1.2-G Relevant information