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DS3154+

DS3154+

Manufacturer No:

DS3154+

Description:

IC TELECOM INTERFACE 144CSBGA

Datasheet:

Datasheet

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DS3154+ Specifications

  • Type
    Parameter
  • Number of Circuits
    4
  • Supplier Device Package
    144-TECSBGA (13x13)
  • Package / Case
    144-BGA, CSPBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    300mA
  • Voltage - Supply
    3.135V ~ 3.465V
  • Interface
    LIU
  • Function
    Line Interface Unit (LIU)
  • Packaging
    Tray
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The DS3154+ is a high-speed quad differential line receiver integrated circuit (IC) chip manufactured by Maxim Integrated. It is primarily designed for applications in communication systems, specifically for receiving high-speed data signals over long distances. Some advantages and application scenarios of the DS3154+ IC chip are:1. High-speed data reception: The DS3154+ is capable of receiving data signals at speeds up to 3.2 Gbps, making it suitable for high-speed communication systems such as fiber optic networks, high-speed serial links, and backplane communication.2. Differential signaling: The chip supports differential signaling, which provides better noise immunity and common-mode rejection, allowing for reliable data reception even in noisy environments.3. Wide input voltage range: The DS3154+ has a wide input voltage range, allowing it to receive signals with varying amplitudes, making it compatible with different communication standards and signal levels.4. Low jitter and skew: The chip features low jitter and skew characteristics, ensuring accurate data reception and synchronization in high-speed communication systems.5. Integrated termination resistors: The DS3154+ includes integrated termination resistors, simplifying the design and reducing the component count in the system.6. Hot-swappable capability: The chip supports hot-swapping, enabling the insertion and removal of devices without disrupting the communication system, making it suitable for applications where devices need to be added or replaced while the system is operational.Application scenarios for the DS3154+ IC chip include:1. Fiber optic communication systems: The chip can be used in fiber optic transceivers and receivers to receive high-speed data signals transmitted over long distances.2. High-speed serial links: It can be employed in high-speed serial links, such as those used in data centers, servers, and storage systems, to receive and process high-speed data streams.3. Backplane communication: The DS3154+ can be utilized in backplane communication systems, where it receives high-speed data signals transmitted over backplane connectors or PCB traces.4. Test and measurement equipment: The chip can be integrated into test and measurement equipment to receive and analyze high-speed data signals for various applications, including signal integrity testing and performance analysis.5. Networking equipment: It can be used in networking equipment, such as routers and switches, to receive high-speed data signals transmitted over Ethernet or other communication protocols.Overall, the DS3154+ IC chip's advantages and application scenarios make it suitable for high-speed communication systems that require reliable data reception, low jitter, and compatibility with various communication standards.
DS3154+ Relevant information