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DS3150TC1+

DS3150TC1+

Manufacturer No:

DS3150TC1+

Description:

IC TELECOM INTERFACE 48TQFP

Datasheet:

Datasheet

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DS3150TC1+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TQFP (7x7)
  • Package / Case
    48-TQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    3.135V ~ 3.465V
  • Number of Circuits
    1
  • Interface
    LIU
  • Function
    Line Interface Unit (LIU)
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The DS3150TC1+ integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of DS3150TC1+ chips are:1. High-Speed Data Transfer: The DS3150TC1+ chips support high-speed data transfer rates, making them suitable for applications that require fast and efficient data communication.2. Low Power Consumption: These chips are designed to operate with low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial.3. Robust Communication Protocol: The DS3150TC1+ chips utilize a robust communication protocol, ensuring reliable and error-free data transmission over long distances.4. Industrial Automation: These chips can be used in industrial automation systems for real-time data monitoring and control, enabling efficient and accurate process automation.5. Telecommunications: DS3150TC1+ chips can be employed in telecommunications equipment, such as routers and switches, to facilitate high-speed data transfer and network connectivity.6. Medical Devices: These chips can be integrated into medical devices, such as patient monitoring systems or diagnostic equipment, to enable fast and secure data transmission between devices and healthcare professionals.7. Automotive Applications: DS3150TC1+ chips can be utilized in automotive applications, such as vehicle diagnostics or infotainment systems, to enable reliable and high-speed data communication within the vehicle.8. Internet of Things (IoT): These chips can be used in IoT devices to enable seamless connectivity and data exchange between various IoT nodes, facilitating efficient and reliable IoT deployments.Overall, the DS3150TC1+ integrated circuit chips offer high-speed data transfer, low power consumption, and robust communication capabilities, making them suitable for a wide range of applications in industries such as industrial automation, telecommunications, medical devices, automotive, and IoT.
DS3150TC1+ Relevant information