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PEF 3452 H V1.3

PEF 3452 H V1.3

Manufacturer No:

PEF 3452 H V1.3

Manufacturer:

Infineon Technologies

Description:

IC TELECOM INTERFACE MQFP-44

Datasheet:

Datasheet

Delivery:

Payment:

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PEF 3452 H V1.3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    PG-MQFP-44-2
  • Package / Case
    44-QFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    110mA
  • Voltage - Supply
    3.13V ~ 3.46V
  • Number of Circuits
    1
  • Interface
    DS3, E3, STS-1
  • Function
    Line Interface Unit (LIU)
  • Packaging
    Tray
  • Product Status
    Discontinued at Digi-Key
  • Series
    -
The PEF 3452 H V1.3 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Performance: The PEF 3452 H V1.3 chips offer high-performance capabilities, enabling efficient and reliable data processing. 2. Versatility: These chips are designed to support various applications, making them suitable for a wide range of scenarios. 3. Power Efficiency: The PEF 3452 H V1.3 chips are power-efficient, ensuring optimal energy consumption and reducing operational costs. 4. Scalability: These chips can be easily scaled up or down based on the requirements of the application, providing flexibility for future upgrades. 5. Security: The PEF 3452 H V1.3 chips incorporate advanced security features, ensuring data protection and preventing unauthorized access.Application Scenarios: 1. Telecommunications: The PEF 3452 H V1.3 chips can be used in telecommunications infrastructure, such as routers, switches, and gateways, to enable high-speed data processing and efficient network management. 2. Internet of Things (IoT): These chips can be utilized in IoT devices, enabling connectivity, data processing, and secure communication between devices. 3. Industrial Automation: The PEF 3452 H V1.3 chips can be employed in industrial automation systems, facilitating real-time data processing, control, and monitoring of manufacturing processes. 4. Smart Grids: These chips can be integrated into smart grid systems, enabling efficient energy management, real-time monitoring, and secure communication between power generation, distribution, and consumption units. 5. Automotive: The PEF 3452 H V1.3 chips can be used in automotive applications, such as advanced driver-assistance systems (ADAS), infotainment systems, and vehicle-to-vehicle communication, enhancing safety and connectivity features.Overall, the PEF 3452 H V1.3 integrated circuit chips offer high performance, versatility, power efficiency, scalability, and security, making them suitable for various applications in telecommunications, IoT, industrial automation, smart grids, and automotive sectors.
PEF 3452 H V1.3 Relevant information