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PEF 3314 E V2.1

PEF 3314 E V2.1

Manufacturer No:

PEF 3314 E V2.1

Manufacturer:

Infineon Technologies

Description:

IC TELECOM INTERFACE 176-LBGA

Datasheet:

Datasheet

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PEF 3314 E V2.1 Specifications

  • Type
    Parameter
  • Supplier Device Package
    PG-LBGA-176
  • Package / Case
    176-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Number of Circuits
    4
  • Interface
    ADPCM
  • Function
    Analog Voice Access
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Discontinued at Digi-Key
  • Series
    VINETIC®
The PEF 3314 E V2.1 integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of these chips are:1. High Performance: The PEF 3314 E V2.1 chips are designed to deliver high performance in terms of data processing and communication capabilities. They can handle complex tasks efficiently, making them suitable for demanding applications.2. Versatility: These chips are versatile and can be used in a wide range of applications. They are commonly used in networking equipment, such as routers, switches, and gateways, to enable efficient data transmission and communication.3. Enhanced Security: The PEF 3314 E V2.1 chips incorporate advanced security features, such as encryption and authentication algorithms, to ensure secure data transmission. This makes them suitable for applications that require secure communication, such as in financial institutions or government organizations.4. Scalability: These chips are designed to be scalable, allowing for easy integration into different systems and configurations. They can be used in both small-scale and large-scale networking setups, making them suitable for various deployment scenarios.5. Energy Efficiency: The PEF 3314 E V2.1 chips are designed to be energy-efficient, consuming minimal power while delivering high performance. This makes them suitable for applications where power consumption is a concern, such as in battery-powered devices or energy-efficient data centers.6. Internet of Things (IoT) Applications: With their high performance, security features, and scalability, these chips can be applied in IoT applications. They can enable efficient communication and data processing in IoT devices, facilitating seamless connectivity and interoperability.7. Telecommunication Networks: The PEF 3314 E V2.1 chips are commonly used in telecommunication networks to enable efficient data transmission and communication between different network elements. They can handle high data volumes and ensure reliable connectivity, making them suitable for telecommunication infrastructure.Overall, the PEF 3314 E V2.1 integrated circuit chips offer high performance, versatility, security, scalability, and energy efficiency, making them suitable for a wide range of applications in networking, IoT, telecommunication, and other industries.
PEF 3314 E V2.1 Relevant information