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PEF 24471 E V1.3

PEF 24471 E V1.3

Manufacturer No:

PEF 24471 E V1.3

Manufacturer:

Infineon Technologies

Description:

IC TELECOM INTERFACE 217BGA

Datasheet:

Datasheet

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PEF 24471 E V1.3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    PG-BGA-217-1
  • Package / Case
    217-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    200mA
  • Voltage - Supply
    3.13V ~ 3.47V
  • Number of Circuits
    1
  • Interface
    PCM, PLL
  • Function
    Switching IC
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    SWITI
The PEF 24471 E V1.3 integrated circuit chips have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The PEF 24471 E V1.3 chips offer high-performance capabilities, enabling efficient and reliable data processing. 2. Versatility: These chips are versatile and can be used in various applications, making them suitable for a wide range of industries. 3. Low Power Consumption: The chips are designed to consume low power, making them energy-efficient and suitable for battery-powered devices. 4. Compact Size: The integrated circuit chips are compact in size, allowing for easy integration into different electronic devices and systems. 5. Cost-Effective: The chips offer a cost-effective solution for implementing advanced communication and networking features.Application Scenarios: 1. Telecommunication Systems: The PEF 24471 E V1.3 chips can be used in telecommunication systems, such as routers, switches, and modems, to enable high-speed data processing and efficient network management. 2. Internet of Things (IoT): These chips can be utilized in IoT devices, enabling seamless connectivity and communication between devices, sensors, and cloud platforms. 3. Industrial Automation: The chips can be integrated into industrial automation systems, providing reliable and efficient data processing for control and monitoring applications. 4. Smart Home Devices: The PEF 24471 E V1.3 chips can be used in smart home devices, such as smart speakers, security systems, and home automation controllers, to enable connectivity and intelligent functionality. 5. Automotive Electronics: These chips can be employed in automotive electronics, enabling advanced features like vehicle-to-vehicle communication, infotainment systems, and driver assistance systems.Overall, the PEF 24471 E V1.3 integrated circuit chips offer high performance, versatility, and low power consumption, making them suitable for various applications in telecommunications, IoT, industrial automation, smart homes, and automotive electronics.
PEF 24471 E V1.3 Relevant information