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PEF 20471 E V1.3

PEF 20471 E V1.3

Manufacturer No:

PEF 20471 E V1.3

Manufacturer:

Infineon Technologies

Description:

IC TELECOM INTERFACE 217BGA

Datasheet:

Datasheet

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PEF 20471 E V1.3 Specifications

  • Type
    Parameter
  • Supplier Device Package
    PG-BGA-217-1
  • Package / Case
    217-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    200mA
  • Voltage - Supply
    3.13V ~ 3.47V
  • Number of Circuits
    1
  • Interface
    PCM, PLL
  • Function
    Switching IC
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    SWITI
The PEF 20471 E V1.3 integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of these chips are:Advantages: 1. High Performance: The PEF 20471 E V1.3 chips are designed to deliver high performance in terms of processing power and data transfer rates. 2. Energy Efficiency: These chips are optimized for energy efficiency, allowing for longer battery life in portable devices or reduced power consumption in other applications. 3. Versatility: The chips are versatile and can be used in a wide range of applications, making them suitable for various industries and use cases. 4. Integration: The PEF 20471 E V1.3 chips are highly integrated, which means they can incorporate multiple functions and features into a single chip, reducing the need for additional components and simplifying the overall design. 5. Cost-Effective: The integration and versatility of these chips make them cost-effective solutions for many applications, as they eliminate the need for multiple specialized components.Application Scenarios: 1. Telecommunications: The PEF 20471 E V1.3 chips can be used in telecommunications equipment, such as routers, switches, and base stations, to enable high-speed data processing and efficient network management. 2. Internet of Things (IoT): These chips can be applied in IoT devices, such as smart home systems, industrial sensors, or wearable devices, to enable connectivity, data processing, and communication capabilities. 3. Automotive: The chips can be used in automotive applications, such as in-vehicle infotainment systems, advanced driver-assistance systems (ADAS), or telematics, to enable efficient data processing, connectivity, and communication. 4. Industrial Automation: The chips can be applied in industrial automation systems, such as programmable logic controllers (PLCs), robotics, or process control systems, to enable real-time data processing, communication, and control. 5. Consumer Electronics: These chips can be used in various consumer electronics devices, such as smartphones, tablets, or smart TVs, to enable high-performance processing, connectivity, and multimedia capabilities.Overall, the PEF 20471 E V1.3 integrated circuit chips offer high performance, energy efficiency, versatility, integration, and cost-effectiveness, making them suitable for a wide range of applications in different industries.
PEF 20471 E V1.3 Relevant information