PEB 3324 E V1.4

PEB 3324 E V1.4

Manufacturer No:

PEB 3324 E V1.4

Manufacturer:

Infineon Technologies

Description:

IC TELECOM INTERFACE 176-LBGA

Datasheet:

Datasheet

Delivery:

Payment:

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PEB 3324 E V1.4 Specifications

  • Type
    Parameter
  • Power (Watts)
    400 mW
  • Supplier Device Package
    PG-LBGA-176
  • Package / Case
    176-LBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Number of Circuits
    4
  • Interface
    ADPCM
  • Function
    Analog Voice Access
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    VINETIC®
The PEB 3324 E V1.4 integrated circuit chips have several advantages and application scenarios:1. Advantages: a. High performance: The PEB 3324 E V1.4 chips offer high-speed data processing capabilities, making them suitable for applications that require fast and efficient data handling. b. Low power consumption: These chips are designed to operate with minimal power consumption, making them ideal for battery-powered devices or energy-efficient applications. c. Compact size: The integrated circuit chips are small in size, allowing for easy integration into various electronic devices and systems. d. Versatility: The PEB 3324 E V1.4 chips support multiple communication protocols and interfaces, making them versatile for a wide range of applications. e. Reliability: These chips are built with robust design and manufacturing processes, ensuring high reliability and long-term performance.2. Application scenarios: a. Communication systems: The PEB 3324 E V1.4 chips can be used in communication systems such as routers, switches, and modems to handle data processing, routing, and protocol conversion tasks. b. Industrial automation: These chips can be employed in industrial automation systems for tasks like data acquisition, control, and monitoring, enabling efficient and reliable operation. c. Internet of Things (IoT): The PEB 3324 E V1.4 chips can be integrated into IoT devices to enable seamless connectivity, data processing, and communication between devices and the cloud. d. Automotive electronics: These chips can be utilized in automotive applications like infotainment systems, advanced driver-assistance systems (ADAS), and vehicle-to-vehicle communication, enhancing the overall functionality and performance. e. Consumer electronics: The PEB 3324 E V1.4 chips can be used in various consumer electronic devices such as smart TVs, set-top boxes, and gaming consoles to enable efficient data processing and connectivity features.Overall, the PEB 3324 E V1.4 integrated circuit chips offer high performance, low power consumption, and versatility, making them suitable for a wide range of applications in communication systems, industrial automation, IoT, automotive electronics, and consumer electronics.