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PEB 20570 F V3.1

PEB 20570 F V3.1

Manufacturer No:

PEB 20570 F V3.1

Manufacturer:

Infineon Technologies

Description:

IC TELECOM INTERFACE TQFP-100

Datasheet:

Datasheet

Delivery:

Payment:

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PEB 20570 F V3.1 Specifications

  • Type
    Parameter
  • Supplier Device Package
    PG-TQFP-100-3
  • Package / Case
    100-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    272.6mA
  • Voltage - Supply
    3.13V ~ 3.47V
  • Interface
    ISDN
  • Function
    Line Card Controller
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The PEB 20570 F V3.1 integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios include:1. High Performance: The PEB 20570 F V3.1 chips are designed to deliver high performance, making them suitable for applications that require fast and efficient processing.2. Communication Systems: These chips are commonly used in communication systems, such as routers, switches, and network equipment. They provide reliable and high-speed data transmission capabilities.3. Networking Applications: The PEB 20570 F V3.1 chips are well-suited for networking applications, including Ethernet switches, network interface cards (NICs), and network processors. They enable seamless connectivity and efficient data transfer.4. Security Features: These chips often come with built-in security features, such as encryption and authentication mechanisms. This makes them ideal for applications that require secure data transmission and protection against unauthorized access.5. Industrial Automation: The PEB 20570 F V3.1 chips can be used in industrial automation systems, such as programmable logic controllers (PLCs) and industrial control systems. They provide reliable and robust processing capabilities for controlling and monitoring industrial processes.6. Internet of Things (IoT): With their high performance and networking capabilities, these chips are suitable for IoT applications. They can be used in IoT gateways, smart home devices, and other IoT-enabled systems to enable seamless connectivity and data processing.7. Automotive Electronics: The PEB 20570 F V3.1 chips find applications in automotive electronics, including advanced driver-assistance systems (ADAS), infotainment systems, and vehicle networking. They offer the necessary processing power and connectivity for these automotive applications.8. Telecommunications: These chips are commonly used in telecommunications equipment, such as base stations, optical network units (ONUs), and access points. They enable efficient data processing and transmission in telecommunication networks.Overall, the PEB 20570 F V3.1 integrated circuit chips provide high performance, networking capabilities, and security features, making them suitable for a wide range of applications in communication systems, networking, industrial automation, IoT, automotive electronics, and telecommunications.
PEB 20570 F V3.1 Relevant information