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DS3150TN+

DS3150TN+

Manufacturer No:

DS3150TN+

Description:

IC TELECOM INTERFACE 48TQFP

Datasheet:

Datasheet

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DS3150TN+ Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TQFP (7x7)
  • Package / Case
    48-TQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    3.135V ~ 3.465V
  • Number of Circuits
    1
  • Interface
    LIU
  • Function
    Line Interface Unit (LIU)
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    -
The DS3150TN+ integrated circuit chips offer several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of DS3150TN+ chips are:1. High-Speed Data Transmission: The DS3150TN+ chips support high-speed data transmission up to 155 Mbps, making them suitable for applications that require fast and reliable data transfer.2. Low Power Consumption: These chips are designed to operate with low power consumption, making them ideal for battery-powered devices or applications where power efficiency is crucial.3. Integrated Features: DS3150TN+ chips come with integrated features such as line drivers, receivers, and equalizers, which simplify the design and reduce the component count in applications like data communication systems.4. Robust Performance: These chips are designed to provide robust performance in noisy environments, making them suitable for applications that require reliable data transmission over long distances or in harsh conditions.5. Wide Temperature Range: DS3150TN+ chips can operate over a wide temperature range, typically from -40°C to +85°C, making them suitable for applications in industrial or automotive environments.6. Serial Communication Interfaces: These chips support various serial communication interfaces like RS-485, RS-422, and RS-232, making them versatile and compatible with a wide range of devices and systems.7. Industrial Automation: DS3150TN+ chips can be used in industrial automation systems for communication between sensors, actuators, and control units, enabling reliable and efficient data exchange.8. Building Automation: These chips can be applied in building automation systems for communication between different devices like HVAC systems, lighting controls, and security systems, enabling centralized control and monitoring.9. Transportation Systems: DS3150TN+ chips can be used in transportation systems for communication between different subsystems like ticketing machines, fare collection systems, and control centers, ensuring reliable data transfer and system integration.10. Medical Devices: These chips can be applied in medical devices for communication between various components like sensors, monitors, and control units, enabling real-time data exchange and remote monitoring.Overall, the DS3150TN+ integrated circuit chips offer high-speed, low-power, and reliable data transmission capabilities, making them suitable for a wide range of applications in different industries.
DS3150TN+ Relevant information