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SI3010-F-GS

SI3010-F-GS

Manufacturer No:

SI3010-F-GS

Manufacturer:

Skyworks Solutions Inc.

Description:

IC TELECOM INTERFACE 16SOIC

Datasheet:

Datasheet

Delivery:

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SI3010-F-GS Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    15mA
  • Voltage - Supply
    3V ~ 3.6V
  • Number of Circuits
    1
  • Interface
    Parallel, SPI, UART
  • Function
    Direct Access Arrangement (DAA)
  • Packaging
    Tube
  • Product Status
    Active
  • Series
    -
The SI3010-F-GS is an integrated circuit chip developed by Silicon Labs. It is a high-performance, low-power, and low-cost solution for various applications. Some of the advantages and application scenarios of the SI3010-F-GS are:1. Low Power Consumption: The chip is designed to operate at low power levels, making it suitable for battery-powered devices and energy-efficient applications.2. Small Form Factor: The SI3010-F-GS is available in a compact package, allowing it to be easily integrated into space-constrained designs.3. High Performance: The chip offers excellent performance characteristics, including high sensitivity and low noise, making it suitable for demanding applications.4. Wide Frequency Range: The SI3010-F-GS supports a wide frequency range, enabling it to be used in various wireless communication systems.5. Cost-Effective Solution: The chip provides a cost-effective solution for wireless communication applications, making it suitable for mass production and cost-sensitive projects.Application Scenarios:1. Internet of Things (IoT): The SI3010-F-GS can be used in IoT devices that require wireless connectivity, such as smart home devices, wearables, and industrial sensors.2. Wireless Sensor Networks: The chip can be utilized in wireless sensor networks for applications like environmental monitoring, asset tracking, and industrial automation.3. Remote Control Systems: The SI3010-F-GS can be employed in remote control systems for consumer electronics, home automation, and automotive applications.4. Wireless Audio and Video Transmission: The chip can be used in wireless audio and video transmission systems, enabling wireless connectivity between devices like speakers, headphones, and displays.5. Industrial and Commercial Applications: The SI3010-F-GS can be utilized in various industrial and commercial applications, including wireless data acquisition, remote monitoring, and control systems.Overall, the SI3010-F-GS integrated circuit chip offers a range of advantages and can be applied in diverse scenarios that require low-power, high-performance, and cost-effective wireless communication solutions.
SI3010-F-GS Relevant information