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U3761MB-XFNG3G

U3761MB-XFNG3G

Manufacturer No:

U3761MB-XFNG3G

Manufacturer:

Microchip Technology

Description:

IC TELECOM INTERFACE 44SSO

Datasheet:

Datasheet

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U3761MB-XFNG3G Specifications

  • Type
    Parameter
  • Supplier Device Package
    44-SSO
  • Package / Case
    44-BSOP (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -25°C ~ 75°C
  • Power (Watts)
    900 mW
  • Current - Supply
    3.8mA
  • Voltage - Supply
    -
  • Number of Circuits
    1
  • Interface
    -
  • Function
    Universal Telephone Circuit
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The U3761MB-XFNG3G integrated circuit chips have several advantages and application scenarios:Advantages: 1. Wide frequency range: The U3761MB-XFNG3G chips support a wide frequency range, making them suitable for various wireless communication applications. 2. High integration: These chips are highly integrated, which reduces the need for external components and simplifies the overall design. 3. Low power consumption: The U3761MB-XFNG3G chips are designed to operate with low power consumption, making them suitable for battery-powered devices. 4. Small form factor: These chips come in a compact form factor, making them suitable for space-constrained applications. 5. High sensitivity: The U3761MB-XFNG3G chips have high sensitivity, enabling reliable and efficient wireless communication.Application Scenarios: 1. Internet of Things (IoT): The U3761MB-XFNG3G chips can be used in IoT devices for wireless communication, enabling connectivity and data transfer between devices. 2. Smart Home: These chips can be used in smart home devices such as smart locks, smart thermostats, and smart lighting systems, enabling wireless control and communication. 3. Wearable Devices: The U3761MB-XFNG3G chips can be used in wearable devices like fitness trackers and smartwatches, enabling wireless connectivity and data synchronization. 4. Industrial Automation: These chips can be used in industrial automation systems for wireless communication between sensors, actuators, and control systems. 5. Remote Monitoring: The U3761MB-XFNG3G chips can be used in remote monitoring systems for applications like environmental monitoring, asset tracking, and surveillance.Overall, the U3761MB-XFNG3G integrated circuit chips offer advantages such as wide frequency range, high integration, low power consumption, and small form factor, making them suitable for various wireless communication applications in IoT, smart home, wearable devices, industrial automation, and remote monitoring.
U3761MB-XFNG3G Relevant information