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SI3010-FS

SI3010-FS

Manufacturer No:

SI3010-FS

Manufacturer:

Skyworks Solutions Inc.

Description:

IC TELECOM INTERFACE 16SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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SI3010-FS Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    15mA
  • Voltage - Supply
    3V ~ 3.6V
  • Number of Circuits
    1
  • Interface
    Parallel, SPI, UART
  • Function
    Direct Access Arrangement (DAA)
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The SI3010-FS integrated circuit chips have several advantages and application scenarios:Advantages: 1. Low power consumption: The SI3010-FS chips are designed to operate at low power levels, making them suitable for battery-powered devices and energy-efficient applications. 2. Small form factor: These chips are available in compact packages, allowing for space-saving designs and integration into small devices. 3. High integration: The SI3010-FS chips integrate multiple functions into a single chip, reducing the need for external components and simplifying the overall system design. 4. Wide operating voltage range: These chips can operate over a wide range of voltage levels, making them suitable for various power supply configurations. 5. Robust communication capabilities: The SI3010-FS chips support reliable and efficient communication protocols, enabling seamless data transfer and connectivity.Application scenarios: 1. Internet of Things (IoT): The SI3010-FS chips can be used in IoT devices for wireless communication, enabling connectivity and data exchange between devices. 2. Home automation: These chips can be utilized in smart home systems to enable wireless control and communication between various devices, such as lights, thermostats, and security systems. 3. Industrial automation: The SI3010-FS chips can be employed in industrial automation systems for wireless monitoring and control of machinery and equipment. 4. Wearable devices: These chips can be integrated into wearable devices, such as fitness trackers and smartwatches, to enable wireless communication and data synchronization with smartphones or other devices. 5. Remote sensing and monitoring: The SI3010-FS chips can be used in remote sensing and monitoring applications, such as environmental monitoring or asset tracking, to wirelessly transmit data from remote locations to a central control system.Overall, the SI3010-FS integrated circuit chips offer low power consumption, small form factor, high integration, and robust communication capabilities, making them suitable for a wide range of applications in IoT, home automation, industrial automation, wearables, and remote sensing.
SI3010-FS Relevant information