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XS170

XS170

Manufacturer No:

XS170

Description:

IC TELECOM INTERFACE 8DIP

Datasheet:

Datasheet

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XS170 Specifications

  • Type
    Parameter
  • Power (Watts)
    800 mW
  • Number of Circuits
    2
  • Supplier Device Package
    8-DIP
  • Package / Case
    8-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Interface
    -
  • Function
    Relay Switch
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The XS170 integrated circuit chips have several advantages and application scenarios:1. High Performance: The XS170 chips are designed for high-performance applications, offering fast processing speeds and efficient power consumption.2. Versatility: These chips are versatile and can be used in various applications, including data centers, cloud computing, artificial intelligence, machine learning, and high-performance computing.3. Scalability: The XS170 chips are highly scalable, allowing for easy integration into different systems and configurations.4. Advanced Features: These chips come with advanced features such as multi-core architecture, high-speed interconnects, and advanced memory management, enabling efficient data processing and handling.5. Energy Efficiency: The XS170 chips are designed to be energy-efficient, reducing power consumption and heat generation, making them suitable for applications where power efficiency is crucial.6. Real-Time Processing: These chips are capable of real-time processing, making them suitable for applications that require quick response times, such as autonomous vehicles, robotics, and industrial automation.7. High Reliability: The XS170 chips are built with high-quality components and undergo rigorous testing, ensuring high reliability and long-term performance.Application scenarios for XS170 chips include:1. Data Centers: XS170 chips can be used in data centers for high-performance computing, data processing, and storage applications.2. Artificial Intelligence and Machine Learning: These chips are well-suited for AI and ML applications, enabling fast and efficient processing of large datasets and complex algorithms.3. Autonomous Vehicles: XS170 chips can be used in autonomous vehicles for real-time processing of sensor data, enabling quick decision-making and control.4. High-Performance Computing: These chips are ideal for high-performance computing applications, such as scientific simulations, weather forecasting, and financial modeling.5. Edge Computing: XS170 chips can be used in edge computing devices, enabling real-time processing and analysis of data at the edge of the network, reducing latency and improving efficiency.6. Cloud Computing: These chips can be utilized in cloud computing infrastructure for efficient data processing and storage, enabling scalable and reliable cloud services.Overall, the XS170 integrated circuit chips offer high performance, scalability, and energy efficiency, making them suitable for a wide range of applications that require fast and efficient data processing.
XS170 Relevant information