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PEF82902FV1.1/M13

PEF82902FV1.1/M13

Manufacturer No:

PEF82902FV1.1/M13

Manufacturer:

Infineon Technologies

Description:

T-SMINTI MODULAR ISDN

Datasheet:

Datasheet

Delivery:

Payment:

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PEF82902FV1.1/M13 Specifications

  • Type
    Parameter
  • Number of Circuits
    1
  • Supplier Device Package
    PG-TQFP-64
  • Package / Case
    64-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    3.135V ~ 3.465V
  • Interface
    IOM-2
  • Function
    ISDN
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    T-SMINT®
The PEF82902FV1.1/M13 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High Integration: The chips are highly integrated, which means they can perform multiple functions in a single chip, reducing the need for additional components and saving space on the circuit board. 2. Low Power Consumption: These chips are designed to operate with low power consumption, making them suitable for battery-powered devices or energy-efficient applications. 3. Versatility: The chips support various communication protocols, such as Ethernet, USB, and UART, making them compatible with a wide range of devices and systems. 4. Robustness: The chips are designed to be robust and reliable, with features like built-in protection circuits and error correction mechanisms, ensuring stable and secure operation.Application Scenarios: 1. Internet of Things (IoT): The chips can be used in IoT devices for communication and connectivity purposes. They can enable devices to connect to the internet, exchange data, and interact with other devices or cloud platforms. 2. Industrial Automation: The chips can be used in industrial automation systems for data communication between different components, such as sensors, actuators, and control units. They can facilitate real-time monitoring, control, and coordination of industrial processes. 3. Home Automation: The chips can be used in smart home systems to enable communication between various devices, such as smart thermostats, lighting systems, security cameras, and voice assistants. They can enable remote control, automation, and integration of different home devices. 4. Automotive Electronics: The chips can be used in automotive electronics for communication between different components, such as engine control units, infotainment systems, and sensors. They can enable data exchange, diagnostics, and control functions in vehicles. 5. Medical Devices: The chips can be used in medical devices for data communication and connectivity, such as patient monitoring systems, medical imaging devices, and telemedicine applications. They can enable remote monitoring, data transmission, and integration with healthcare systems.These are just a few examples of the advantages and application scenarios of PEF82902FV1.1/M13 integrated circuit chips. The actual usage may vary depending on specific requirements and system designs.
PEF82902FV1.1/M13 Relevant information