BCM56472A0KFSBG

BCM56472A0KFSBG

Manufacturer No:

BCM56472A0KFSBG

Manufacturer:

Broadcom Limited

Description:

980 GBPS AGGREGATION SWITCH

Datasheet:

Datasheet

Delivery:

Payment:

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BCM56472A0KFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Interface
    -
  • Function
    Switch
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The BCM56472A0KFSBG is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the BCM56472A0KFSBG integrated circuit chips are:Advantages: 1. High Port Density: The chip supports up to 72 ports, allowing for a large number of devices to be connected simultaneously. 2. High Performance: It provides high-speed switching capabilities, enabling fast data transfer rates and low latency. 3. Power Efficiency: The chip is designed to be power-efficient, reducing energy consumption and operating costs. 4. Advanced Features: It supports various advanced features like Quality of Service (QoS), VLAN, and security protocols, enhancing network performance and security. 5. Scalability: The chip can be used in scalable network architectures, allowing for easy expansion and growth.Application Scenarios: 1. Data Centers: The high port density and performance of the chip make it suitable for data center environments where large amounts of data need to be processed and transferred quickly. 2. Enterprise Networks: The chip can be used in enterprise networks to connect a large number of devices, such as computers, servers, and IP phones, providing high-speed and reliable connectivity. 3. Service Provider Networks: It can be utilized in service provider networks to build high-capacity and high-performance switches and routers, enabling efficient data transmission for internet service providers. 4. Campus Networks: The chip can be deployed in campus networks, connecting multiple buildings and providing high-speed connectivity for educational institutions or corporate campuses. 5. Industrial Applications: The chip's power efficiency and advanced features make it suitable for industrial applications, such as factory automation, where reliable and secure network connectivity is required.Overall, the BCM56472A0KFSBG integrated circuit chips offer high performance, scalability, and advanced features, making them suitable for various networking applications.