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BCM56072A0KFSBG

BCM56072A0KFSBG

Manufacturer No:

BCM56072A0KFSBG

Manufacturer:

Broadcom Limited

Description:

CENTRALIZED LINE-CARD SWITCH W/O

Datasheet:

Datasheet

Delivery:

Payment:

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BCM56072A0KFSBG Specifications

  • Type
    Parameter
  • Number of Circuits
    1
  • Supplier Device Package
    896-FCBGA (25x25)
  • Package / Case
    896-BFBGA, FCBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    56mA
  • Voltage - Supply
    3.3V
  • Interface
    I²C, JTAG, PCI, Serial, SerDes, UART
  • Function
    Ethernet Switch
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The BCM56072A0KFSBG is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of this chip are:Advantages: 1. High Port Density: The BCM56072A0KFSBG chip supports up to 72 ports, allowing for a high density of Ethernet connections in a single device. 2. Power Efficiency: It is designed to be power-efficient, reducing energy consumption and operating costs. 3. Advanced Features: The chip supports advanced features like Quality of Service (QoS), VLAN tagging, and multicast support, enabling efficient network management and traffic control. 4. High Performance: It provides high-speed switching capabilities, ensuring low latency and fast data transfer rates. 5. Scalability: The chip supports stacking, allowing multiple switches to be interconnected and managed as a single unit, providing scalability for expanding network requirements.Application Scenarios: 1. Data Centers: The high port density and advanced features of the BCM56072A0KFSBG chip make it suitable for use in data centers, where large amounts of network traffic need to be efficiently managed and routed. 2. Enterprise Networks: It can be used in enterprise networks to provide high-performance and reliable connectivity for a large number of devices, such as computers, servers, and IP phones. 3. Campus Networks: The chip's scalability and stacking capabilities make it suitable for use in campus networks, where multiple switches need to be interconnected to provide seamless connectivity across a large area. 4. Service Provider Networks: It can be used in service provider networks to deliver high-speed and reliable connectivity to customers, ensuring efficient data transfer and network management. 5. Industrial Applications: The chip's power efficiency and advanced features make it suitable for use in industrial applications, where reliable and efficient networking is required for automation, control systems, and monitoring.Overall, the BCM56072A0KFSBG chip offers high performance, advanced features, and scalability, making it suitable for a wide range of networking applications.
BCM56072A0KFSBG Relevant information