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BCM56463B0KFSBG

BCM56463B0KFSBG

Manufacturer No:

BCM56463B0KFSBG

Manufacturer:

Broadcom Limited

Description:

BACKHAUL ACCESS SWITCH. BLOWN

Datasheet:

Datasheet

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BCM56463B0KFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Interface
    -
  • Function
    -
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    *
The BCM56463B0KFSBG integrated circuit chips, also known as the Broadcom StrataXGS Trident II Plus, have several advantages and application scenarios. Here are some of them:Advantages: 1. High Performance: The BCM56463B0KFSBG chips offer high-performance switching capabilities, making them suitable for demanding networking applications. 2. Scalability: These chips support a large number of ports, allowing for scalable network designs. 3. Flexibility: The chips support various network protocols and features, providing flexibility in network configurations. 4. Power Efficiency: The BCM56463B0KFSBG chips are designed to be power-efficient, reducing energy consumption in networking devices. 5. Advanced Features: These chips offer advanced features like deep packet inspection, quality of service (QoS) management, and security functionalities.Application Scenarios: 1. Data Centers: The high-performance and scalability of the BCM56463B0KFSBG chips make them suitable for data center networking applications. They can handle large amounts of data traffic and provide low-latency switching. 2. Enterprise Networks: These chips can be used in enterprise networks to support high-speed connectivity, VLAN management, and advanced security features. 3. Service Provider Networks: The BCM56463B0KFSBG chips can be utilized in service provider networks to deliver high-speed internet connectivity, support virtual private networks (VPNs), and enable advanced routing functionalities. 4. Campus Networks: These chips can be deployed in campus networks to provide high-bandwidth connectivity between different buildings or departments, supporting features like link aggregation and multicast routing. 5. Telecommunication Networks: The BCM56463B0KFSBG chips can be used in telecommunication networks to handle high volumes of voice, video, and data traffic, ensuring reliable and efficient communication services.Overall, the BCM56463B0KFSBG integrated circuit chips offer high-performance, scalability, and advanced features, making them suitable for a wide range of networking applications.
BCM56463B0KFSBG Relevant information