BCM56277A1KFSBG

BCM56277A1KFSBG

Manufacturer No:

BCM56277A1KFSBG

Manufacturer:

Broadcom Limited

Description:

48 GE FRONT PANEL SWITCH W/O BRO

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

BCM56277A1KFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Interface
    -
  • Function
    -
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    *
The BCM56277A1KFSBG is a specific model of integrated circuit chip developed by Broadcom. It is a high-performance Ethernet switch chip designed for data center and enterprise networking applications. Some of the advantages and application scenarios of this chip are:1. High Performance: The BCM56277A1KFSBG chip offers high-speed switching capabilities, supporting up to 400 Gigabit Ethernet (GbE) ports. It provides low-latency and high-bandwidth connectivity, enabling efficient data transfer and processing.2. Scalability: This chip is designed to support large-scale networks, making it suitable for data centers and enterprise environments that require extensive connectivity. It offers flexible port configurations and can be used in various network topologies.3. Advanced Features: The BCM56277A1KFSBG chip incorporates advanced features such as deep packet buffering, congestion management, and quality of service (QoS) mechanisms. These features ensure efficient traffic management, prioritization, and congestion avoidance in high-demand networks.4. Energy Efficiency: Broadcom's chip is designed with power-saving features, including low-power modes and energy-efficient Ethernet (EEE) support. This helps reduce power consumption and operational costs in data center and enterprise environments.5. Network Virtualization: The chip supports network virtualization technologies like Virtual Extensible LAN (VXLAN) and Network Virtualization using Generic Routing Encapsulation (NVGRE). These features enable the creation of virtual networks, enhancing network flexibility and scalability.6. Data Center Applications: The BCM56277A1KFSBG chip is particularly suitable for data center applications, where high-performance switching and low-latency connectivity are crucial. It can be used in spine-leaf architectures, top-of-rack (ToR) switches, and other data center network deployments.7. Enterprise Networking: The chip is also applicable in enterprise networking scenarios, where high-speed and reliable connectivity is required. It can be used in campus networks, aggregation switches, and distribution switches, providing efficient connectivity for various devices and services.Overall, the BCM56277A1KFSBG chip offers high-performance, scalability, and advanced features, making it suitable for demanding networking applications in data centers and enterprise environments.