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BCM82790BIFSBG

BCM82790BIFSBG

Manufacturer No:

BCM82790BIFSBG

Manufacturer:

Broadcom Limited

Description:

I TEMP 100 GEARBOX FOR CR4/SR4/L

Datasheet:

Datasheet

Delivery:

Payment:

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BCM82790BIFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    -
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Supply
    -
  • Voltage - Supply
    -
  • Interface
    -
  • Function
    -
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The BCM82790BIFSBG is a high-performance integrated circuit chip developed by Broadcom. It is specifically designed for use in optical networking applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed performance: The BCM82790BIFSBG chip supports data rates of up to 400 Gbps, making it suitable for high-speed optical networking applications. 2. Low power consumption: It is designed to operate with low power consumption, making it energy-efficient and suitable for power-sensitive applications. 3. High integration: The chip integrates multiple functions, including optical transceiver control, signal conditioning, and digital signal processing, reducing the need for external components and simplifying system design. 4. Flexibility: It supports various optical networking protocols, such as Ethernet, OTN (Optical Transport Network), and Fibre Channel, providing flexibility in different application scenarios.Application scenarios: 1. Data centers: The BCM82790BIFSBG chip can be used in high-speed optical interconnects within data centers, enabling efficient data transmission between servers, switches, and storage systems. 2. Telecommunication networks: It can be used in optical transport systems to enable high-speed data transmission over long distances, supporting the growing demand for bandwidth in telecommunication networks. 3. Cloud computing: The chip can be utilized in cloud computing infrastructure to enable fast and reliable data transfer between cloud servers and storage systems. 4. High-performance computing: It can be employed in high-performance computing clusters to facilitate fast data communication between nodes, improving overall system performance.Overall, the BCM82790BIFSBG integrated circuit chip offers high-speed, low-power, and highly integrated capabilities, making it suitable for various optical networking applications in data centers, telecommunication networks, cloud computing, and high-performance computing.
BCM82790BIFSBG Relevant information