BCM56271A0IFEBG
Manufacturer No:
BCM56271A0IFEBG
Manufacturer:
Description:
4X2.5G+4X10G+4X2.5G SWITCH, I-TE
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BCM56271A0IFEBG Specifications
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TypeParameter
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Supplier Device Package-
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Package / Case-
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Mounting Type-
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Operating Temperature-40°C ~ 85°C
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FunctionSwitch
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PackagingTray
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Product StatusActive
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Series-
The BCM56271A0IFEBG is a specific model of integrated circuit chip developed by Broadcom. It is a high-performance Ethernet switch chip designed for use in networking equipment. Some of the advantages and application scenarios of this chip are:1. High Performance: The BCM56271A0IFEBG chip offers high-performance switching capabilities, enabling fast and efficient data transfer in networking devices. It supports advanced features like wire-speed switching, low-latency forwarding, and high bandwidth capacity.2. Scalability: This chip is designed to support large-scale network deployments. It offers a high number of ports, allowing for the connection of multiple devices and enabling the creation of complex network topologies.3. Power Efficiency: The BCM56271A0IFEBG chip is designed to be power-efficient, helping to reduce energy consumption in networking devices. This is particularly important in data centers and other environments where power efficiency is a priority.4. Advanced Features: The chip supports various advanced features like Quality of Service (QoS) prioritization, VLAN tagging, and multicast support. These features enable the creation of more efficient and secure networks.5. Application Scenarios: The BCM56271A0IFEBG chip is commonly used in networking equipment such as switches, routers, and data center switches. It is suitable for a wide range of applications, including enterprise networks, data centers, service provider networks, and cloud computing environments.Overall, the BCM56271A0IFEBG chip offers high-performance switching capabilities, scalability, power efficiency, and advanced features, making it suitable for various networking applications.
BCM56271A0IFEBG Relevant information