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BCM82756AKFSBG

BCM82756AKFSBG

Manufacturer No:

BCM82756AKFSBG

Manufacturer:

Broadcom Limited

Description:

TRANSCEIVER

Datasheet:

Datasheet

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BCM82756AKFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-FBGA (17x17)
  • Package / Case
    256-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Supply
    -
  • Voltage - Supply
    1V
  • Number of Circuits
    4
  • Interface
    XFI, 2-Wire Serial
  • Function
    Switch
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The BCM82756AKFSBG is a high-performance integrated circuit chip developed by Broadcom. It is specifically designed for use in optical networking applications. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed performance: The BCM82756AKFSBG chip supports data rates of up to 400 Gbps, making it suitable for high-speed optical networking applications. 2. Low power consumption: It is designed to operate with low power consumption, making it energy-efficient and suitable for power-sensitive applications. 3. High port density: The chip supports multiple ports, allowing for high port density in networking equipment, which helps in optimizing rack space and reducing costs. 4. Advanced signal processing: It incorporates advanced signal processing techniques to enhance the quality and reliability of optical signals, ensuring high-performance data transmission. 5. Flexibility and scalability: The chip offers flexibility and scalability, allowing for easy integration into various networking equipment and supporting future upgrades and expansions.Application scenarios: 1. Data centers: The BCM82756AKFSBG chip is commonly used in data centers for high-speed optical interconnects between servers, switches, and routers. It enables efficient data transmission and helps in managing the increasing bandwidth demands of modern data centers. 2. Telecommunication networks: It is used in telecommunication networks for high-speed optical links between network nodes, such as routers and switches. The chip ensures reliable and high-performance data transmission in these networks. 3. Metro and long-haul networks: The chip is suitable for metro and long-haul optical networks, where high-speed data transmission over long distances is required. It enables efficient connectivity between different network nodes and helps in expanding network capacity. 4. Cloud computing: The chip is utilized in cloud computing environments to support high-speed data transfer between cloud servers and storage systems. It enables efficient and reliable data communication within the cloud infrastructure. 5. High-performance computing: It is used in high-performance computing systems, such as supercomputers and high-performance clusters, to enable fast and efficient data communication between computing nodes. The chip helps in improving the overall performance of these systems.Overall, the BCM82756AKFSBG chip offers high-speed performance, low power consumption, and advanced signal processing capabilities, making it suitable for various optical networking applications in data centers, telecommunication networks, cloud computing, and high-performance computing.
BCM82756AKFSBG Relevant information