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BCM56272A0IFEBG

BCM56272A0IFEBG

Manufacturer No:

BCM56272A0IFEBG

Manufacturer:

Broadcom Limited

Description:

4X1G+4X1G SWITCH, I-TEMP

Datasheet:

Datasheet

Delivery:

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BCM56272A0IFEBG Specifications

  • Type
    Parameter
  • Supplier Device Package
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  • Package / Case
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  • Mounting Type
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  • Operating Temperature
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  • Current - Supply
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  • Voltage - Supply
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  • Interface
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  • Function
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  • Packaging
    Tray
  • Product Status
    Active
  • Series
    *
The BCM56272A0IFEBG is a specific model of integrated circuit chip developed by Broadcom. It is a high-performance Ethernet switch chip designed for use in data center and enterprise networking applications. Some of the advantages and application scenarios of this chip are:1. High Performance: The BCM56272A0IFEBG chip offers high-performance switching capabilities, enabling fast and efficient data transfer within a network. It supports advanced features like line-rate forwarding, low-latency switching, and high bandwidth capacity.2. Scalability: This chip is designed to support large-scale networks with multiple switches and devices. It offers high port density, allowing for the connection of numerous devices and enabling network expansion as per requirements.3. Energy Efficiency: The BCM56272A0IFEBG chip incorporates energy-efficient features, such as low-power consumption and power-saving modes. This makes it suitable for deployment in energy-conscious environments, reducing overall power consumption and operational costs.4. Advanced Features: The chip supports various advanced networking features, including VLAN (Virtual Local Area Network) tagging, Quality of Service (QoS) prioritization, multicast support, and security features like Access Control Lists (ACLs). These features enhance network performance, security, and management capabilities.5. Data Center and Enterprise Networking: The BCM56272A0IFEBG chip is specifically designed for data center and enterprise networking applications. It can be used in switches, routers, and other network equipment deployed in these environments. Its high performance and scalability make it suitable for handling large volumes of data traffic in such settings.6. Cloud Computing and Virtualization: With the increasing adoption of cloud computing and virtualization technologies, the BCM56272A0IFEBG chip can be used in network switches within cloud data centers. It provides the necessary performance and features to handle the demands of virtualized environments and ensure efficient data transfer between virtual machines.7. High-Speed Connectivity: The chip supports high-speed Ethernet connectivity, including 10 Gigabit Ethernet (10GbE) and 25 Gigabit Ethernet (25GbE). This makes it suitable for high-bandwidth applications, such as video streaming, large-scale data transfers, and high-performance computing.Overall, the BCM56272A0IFEBG integrated circuit chip offers high-performance, scalability, and advanced features, making it suitable for data center, enterprise, cloud computing, and high-speed networking applications.
BCM56272A0IFEBG Relevant information