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BCM82756AIFSBG

BCM82756AIFSBG

Manufacturer No:

BCM82756AIFSBG

Manufacturer:

Broadcom Limited

Description:

10G MACSEC

Datasheet:

Datasheet

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BCM82756AIFSBG Specifications

  • Type
    Parameter
  • Supplier Device Package
    256-BGA (17x17)
  • Package / Case
    256-BGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -
  • Current - Supply
    -
  • Voltage - Supply
    1V
  • Number of Circuits
    4
  • Interface
    2-Wire Serial
  • Function
    Ethernet
  • Packaging
    Tray
  • Product Status
    Active
  • Series
    -
The BCM82756AIFSBG is a high-speed integrated circuit chip developed by Broadcom. It is specifically designed for optical networking applications and offers several advantages and application scenarios:1. High-Speed Data Transmission: The BCM82756AIFSBG supports data rates of up to 400 Gbps, making it suitable for high-speed optical networking applications. It enables the transmission of large volumes of data over long distances quickly and efficiently.2. Low Power Consumption: This chip is designed to operate with low power consumption, making it energy-efficient. It helps reduce power consumption in optical networking systems, leading to cost savings and improved sustainability.3. Compact Size: The BCM82756AIFSBG is a highly integrated chip, which means it combines multiple functions into a single device. Its compact size allows for space-saving designs in optical networking equipment, making it suitable for applications with limited physical space.4. Flexibility and Scalability: The chip offers flexibility and scalability, allowing it to be used in various optical networking scenarios. It can be integrated into different types of optical transceivers, switches, and routers, providing a versatile solution for network infrastructure.5. High Reliability: Broadcom is known for its high-quality and reliable products. The BCM82756AIFSBG chip is designed to meet stringent industry standards, ensuring reliable performance in demanding networking environments.Application scenarios for the BCM82756AIFSBG chip include:1. Data Centers: With its high-speed data transmission capabilities, the chip is suitable for data center applications where large volumes of data need to be transmitted quickly and efficiently.2. Telecommunications Networks: The chip can be used in telecommunications networks to enable high-speed data transmission between different network nodes, such as switches and routers.3. Cloud Computing: Cloud service providers can benefit from the chip's high-speed and low power consumption features to enhance their network infrastructure and improve data transfer efficiency.4. Internet Service Providers (ISPs): ISPs can utilize the chip in their optical networking equipment to offer high-speed internet connectivity to their customers.5. Enterprise Networks: The chip can be integrated into switches and routers used in enterprise networks to enable high-speed data transmission and improve network performance.Overall, the BCM82756AIFSBG chip offers high-speed, low power consumption, and compact size advantages, making it suitable for various optical networking applications in data centers, telecommunications networks, cloud computing, ISPs, and enterprise networks.
BCM82756AIFSBG Relevant information