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BCM53443B0KFSBG

BCM53443B0KFSBG

Manufacturer No:

BCM53443B0KFSBG

Manufacturer:

Broadcom Limited

Description:

24GE + 4XGE L2+ MANAGED SWITCH

Datasheet:

Datasheet

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BCM53443B0KFSBG Specifications

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    Parameter
  • Supplier Device Package
    -
  • Package / Case
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  • Mounting Type
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  • Operating Temperature
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  • Current - Supply
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  • Voltage - Supply
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  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    *
The BCM53443B0KFSBG is a highly integrated Ethernet switch chip developed by Broadcom. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the BCM53443B0KFSBG integrated circuit chips are:Advantages: 1. High Port Density: The chip supports up to 48 Gigabit Ethernet ports, allowing for the creation of high-density switch systems. 2. Advanced Switching Features: It provides advanced features like VLAN, QoS, and multicast support, enabling efficient network management and traffic control. 3. Power Efficiency: The chip is designed to be power-efficient, reducing energy consumption and operating costs. 4. Scalability: It supports stacking, allowing multiple switches to be interconnected and managed as a single logical unit, providing scalability and flexibility in network expansion. 5. Robust Security: The chip incorporates security features like Access Control Lists (ACLs) and port security, ensuring secure and controlled access to the network.Application Scenarios: 1. Enterprise Networks: The BCM53443B0KFSBG chip can be used in enterprise networks to build high-performance and scalable Ethernet switches. It can handle the demands of large organizations with multiple departments and high data traffic. 2. Data Centers: With its high port density and advanced features, the chip is suitable for data center environments. It can be used to create top-of-rack switches or spine switches in a leaf-spine architecture, providing high-speed connectivity and efficient traffic management. 3. Service Provider Networks: The chip can be utilized in service provider networks to build carrier-grade Ethernet switches. It enables the delivery of high-bandwidth services and supports features like Quality of Service (QoS) and multicast, essential for service providers. 4. Campus Networks: The chip can be deployed in campus networks, connecting various buildings and departments. Its scalability and stacking capabilities make it suitable for expanding networks as per the organization's requirements. 5. Industrial Networks: The chip's robustness and power efficiency make it suitable for industrial applications. It can be used in industrial Ethernet switches to provide reliable and secure connectivity in harsh environments.Overall, the BCM53443B0KFSBG integrated circuit chips offer high port density, advanced features, power efficiency, and scalability, making them suitable for various network environments, including enterprise networks, data centers, service provider networks, campus networks, and industrial networks.
BCM53443B0KFSBG Relevant information